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Product
Non-contact Inline Sheet Resistance Measurement Module For Conductive Layer On Substrate
NC-700
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*Inline measurement module for moving substrates such as PET film, glass or paper*Continuous measurement(~24h) in Roll to Roll with OFF-SET FREE capability system*Various applications from the research and development to the production line
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Product
Multiple Angle Reflectometry
FilmTek 4000
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Scientific Computing International
Fully-automated wafer metrology optimized for photonic integrated circuit manufacturing. Delivers unmatched measurement accuracy, with a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems. Designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.
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Product
Tensile Testing Machines
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Is an intelligent tensile testing machine specializing in testing the mechanical properties of various flexible packaging materials. It is suitable for test the peel force, heat seal strength, tearing resistance, deformation, puncture resistance, open force, low speed unwinding force etc of plastic film, composite film, soft packaging materials, adhesives, rubber, paper fiber and other products.
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Product
Micro-spot DUV Spectroscopic Reflectometry
FilmTek 2000 PAR
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Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
