Metrology
field of measurement.
See Also: Measurement, Instrumentation, Coordinate Measuring Machines
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Metrology
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KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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Dimensional Metrology System
PINNACLE PLUS
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Pinnacle+ Plus elevates Pinnacle performance to the next level. Pinnacle+ Plus features a rigid granite optical support structure and a high performance Z-axis motion assembly to produce the lowest possible uncertainty on micro-electronic parts and assemblies/
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Photovoltaic/Solar Metrology System
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Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.
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Metrology System
Atlas V
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The new Atlas V metrology system is designed to measure several key steps that include buried features, not visible by CD-SEM and other techniques. Through remarkable improvements in the optical systems, mechanical sub-systems and software algorithms, the Atlas V system can precisely measure the very subtle variations for device parameters and reveal weak process corners for engineers to improve their process robustness in the fab.
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Digital Readouts & Metrology Tools
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HEIDENHAIN digital readouts have universal applications. In addition to standard tasks on milling, drilling and boring machines and lathes, they also can be used with machine tools, measuring and testing equipment, and special machines in fact, they can be used with any machine where axis slides are traversed manually.
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Particle Metrology System
Archimedes
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Archimedes is an innovative instrument which uses the technique of resonant mass measurement to detect and accurately size and count particles in the size range 50nm to 5um*. Archimedes can distinguish different species from their buoyant mass is particularly useful when characterizing proteinaceous aggregates from contaminating silicon oil in biopharmaceutical preparations, in distinguishing bubbles from lipid micelles and contaminants in ultrasound contrast agents or protein from fat in dairy products.
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3D Metrology Solutions
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SHINING 3D owns multiple core technologies in the field of 3D machine vision based 3D inspection, bringing a variety of independent research and development equipment including laser handheld 3D scanner, blue-light high-precision 3D scanner for inspection system, intelligent robot automatic 3D inspection system, wireless optical portable CMM system and etc.
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Manual Semiconductor Metrology System
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Front USB port enables easy storage of measurements and other data to flash drivesMTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and DependabilityNon-contact measurements76-300 mm diameter wafer rangeOptional wafer measurement ringsWafer stops for exact centeringEthernet interfaceFull remote control software (Windows compatible)Optional calibration wafers
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Scatterometers / Thin Film Metrology Systems
OptiPrime Series
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The n&k OptiPrime series are automated metrology systems used to fully characterize and monitor Thin Film and OCD applications for both current and next generation IC processes.
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Dimensional Metrology System
SUMMIT
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The VIEW Summit systems are designed for components requiring a large work envelope and high accuracy. Based on the same core technologies of optics, high speed linear motors, and high resolution scales used in the VIEW Pinnacle, the Summit features a fixed bridge design. Separate X and Y axis motion systems ensure that neither influences the mechanical integrity of the other, while also enabling easy loading and unloading of large parts.
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Quantum & Metrology Instruments
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Beyond quantum sensors, Exail’s photonics solutions enable real applications in other quantum technology fields. They also enable precise control and transmission of the frequency, phase and amplitude of a laser light through fibered telecommunication links, for metrology applications. The true and deep understanding of Exail teams for the fundamental physics behind its technology explains the absolute quality of its time & frequency reference products.
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Materials Metrology
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Nova is a market leader for innovative thin film metrology and process control technologies. We develop highly sensitive in-line metrology solutions on high productivity platforms, thereby enabling critical metrology solutions to be closer to a semiconductor fab’s process and integration needs.Our technologies enable customers to accurately detect and quantify small variations in film composition and thickness, thereby influencing better device functionality, and improved manufacturing yield.
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E-beam Metrology And Inspection
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Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Coupler Metrology
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Rosenberger Hochfrequenztechnik GmbH & Co. KG
Rosenberger provides directional coupler-based measurement techniques as well as probes for comprehensive cross-domain coupling analysis.Nowadays, the introduction of new accessories within vehicles, like rear seat infotainment, smart dashboards, and various advanced driver assistance systems, has increased the demand for high-speed automotive bus systems working in parallel with the high-voltage power networks in electric cars.
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Inspection & Metrology Platform
Neon
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Neon is Cohu’s next generation inspection platform optimized for small, fragile semiconductors used in automotive, consumer, industrial and medical, and mobility applications.
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Warpage Metrology System
TableTop Shadow Moiré (TTSM)
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Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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Automated Metrology System
EVG®50
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High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Optical Metrology
YieldStar
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Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.
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Process XRR, XRF, and XRD metrology FAB tool
MFM310
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Thickness, density, roughness & composition of films on blanket and patterned wafers. The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.
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Metrology System
IVS
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The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
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High Precision 3D Metrology
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Ensure zero-defect quality in all product deliveries and boost customer satisfaction: ISRA’s precision metrology systems measure all object and surface properties down to the nanometer level while ensuring the shortest cycle times.
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Metrology Systems
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Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. By implementing feedback loops, both process control and process parameter correction are enabled, which allow compliance to tighter process requirements. EVG's metrology solutions are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.
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Potable Coordinate Measuring Machines
Romer
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A first in the world of portable measuring arms: The ROMER Absolute Arm features absolute encoders and is therefore the first measuring arm which does not require referencing before measurement. When the arm is turned on, it’s ready to go.Quality control, inspection, on-machine verification, reverse engineering, virtual assembly or 3D modelling. Wherever these needs arise, you will find the ROMER Absolute Arm. Much more than just a metrology tool, its value lies in its versatility.Portability, stability, light weight and high-performance laser scanners make the ROMER Absolute Arm an all-purpose 3D measurement, analysis and digitising tool that can be used by anyone, anywhere and with minimum training.Unlike many metrology devices, the ROMER Absolute Arm does not require warm-up time or initialization, thanks to a stable carbon fiber structure and industry leading Absolute encoders. Simply take the measuring arm to the part, switch it on and start measuring.
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Analytical Software for Microscopy
SPIP
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SPIP™ or Scanning Probe Image Processor - is an advanced software package for processing and analyzing microscopic images at nano- and microscale. It has been developed as a proprietary software by Image Metrology and is unique in the microscopy and microscale research market. With the high level of usable features, SPIP provides industrial and academic researchers with an advanced toolkit for working with microscope images, incl. extracting data from most microscopy file types, cleaning and enhancing data, analyzing measurements, visualizing and reporting analysis results. The software is used for research and innovation in a variety of industries such as pharmaceutical, cosmetics, semiconductors, hard disk manufacturing, polymer and aluminum manufacturing. Furthermore, SPIP is widely recognized as the standard microscope image analysis software for research and education at leading universities, and has been cited in more than 1200 scientific publications.
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Adapter, 2.4 mm (m) to 3.5 mm (f), DC to 26.5 GHz
11901C
Coax Adapter
The Keysight 11901C is a metrology grade, 2.4 mm male to 3.5 mm female adapter with dc to 26.5 GHz operation.
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Adapter, 2.4 mm (f) to APC-7, DC to 18 GHz
11902B
Coax Adapter
The Keysight 11902B is a metrology grade, 2.4 mm female to APC-7 adapter with dc to 18 GHz operation.
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Static and dynamic analysis
MEMS
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Static and dynamic analysis and visualization are critical parts of the test and development process for MEMS microstructures in order to characterize surface metrology and measure in and out of plane motions. The PS4L Adaptive Architecture is ideal for configuring a system to perform tests to very specialized requirements of the MEMS customer. MEMS customers often require vacuum probing, which is available in semiautomatic and fully automatic configurations.
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Metrology Systems
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High-precision, wavefront-based tools for measuring and testing optical components, specializing in Shack-Hartmann sensor technology.
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3D Scanning System
CyberGage360
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Unprecedented combination of speed, accuracy and one-button simplicity for non-contact automated 3D scanning inspection.CyberGage360 dramatically Speeds Up Quality Assurance of Incoming Parts Inspection & In-Process Inspection of components on the manufacturing floor; Lowers Cost of Quality & Speeds Up Product Time-to-Market. Designed for use in general purpose metrology, the CyberGage360 has a range of potential industrial applications from automotive to aerospace to consumer electronics, where high accuracy and high speed throughput are important.
