Sockets
receive conductors.
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Product
Custom Sockets
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Plastronics socket designs range from off-the-shelf sockets ready for immediate delivery, semi-custom sockets that utilize universal components and totally custom one-of-a-kind sockets and fixtures.
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Module Sockets
Ardent Optical Engine
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The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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GHz Elastomer Sockets
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Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Product
Aspen Sockets
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Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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BGA Sockets
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Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Product
Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Test Sockets & Interposers
Silmat
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Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Smart Sockets
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Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the electronic circuitry inside the lid. These activations are counted by the counter IC and displayed in LCD. Let’s say a contact element is rated for 2K insertions. After 2K insertions, this contact element will be replaced by new contact element. Now, the counter has to start the counting from the beginning. To achieve this function, a reset option is included in the electronics circuitry. When reset is actuated, LCD display will go to “0”.
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MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
BGA Sockets
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Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Product
Sockets
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Ironwood Electronics Sockets – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP)– Compressible silver button in polyimide (GT/GTP)– Surface mount adapters for sockets (SF)
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Product
Relay Sockets & Accessories For Power Relays
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Suitable for 35mm rail (DIN), wall or PCB mounting, timer modules, key receptables and retaining clips. See below for all models/series.
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Product
Custom Test Sockets
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RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Product
Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Product
Three-Phase Smart Socket
WECO 3230
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Utilize the RW-3X's features while on site in the van, as well as back at the shop with the WECO 3230 Three-Phase Smart Socket. The 3230 features built-in laser optics, Smart Socket™ technology and automatic meter form selection. Connect the RW-3X to the 3230 side panel using the included cables and the RW-3X Winboard Embedded software automatically sets the meter form, which will then populate on the WECO 3230 LCD display panel, and now you are ready to test. Not only does the 3230 make testing meters a snap, but it expands the current capability of the RW-3X to a full 50 amps, allowing the user to test class 320 amp meters.
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Product
Socket with Bifurcated Contact Solder Tail Pins
Series 0511
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Strip-Line Sockets with Bifurcated Contact Solder Tail Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in solder tail or wire wrap pins. Consult Data Sheet No. 12009 for wire wrap pins. Optional spacer available for mounting on .300 [7.62], .600
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Product
2U Rackmount Network Appliance Platform With Dual LGA3647 Socket Intel® Xeon® Scalable Processors, Intel® C621 (Purley) And Up To 66 LAN
NA860
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The NA860 offers a perfect mixture of performance, flexibility, and durability with server-class dual LGA3647 socket Intel® Xeon® Scalable processors and Intel® C621 chipset (codename: Purley). It is robust and highly reliable for use in a wide range of network applications such as SDN, NGFW, IDS, IPS, UTM, etc. Designed with flexibility in mind, the 2U rackmount network computing system is capable of managing numerous connected computers through an integration of up to eight expandable NIC modules which support a maximum of 66 LAN ports. These NIC modules feature support for copper, fiber, bypass, 1G/10G/40G Ethernet speeds, and hardware acceleration. The NA860 comes with twelve high-capacity DDR4-2400 R-DIMM slots with up to 384GB non-buffer non-ECC/ECC memory. Moreover, there are two hot-swappable 2.5-inch SATA HDD trays, one mSATA slot and one optional 3.5-inch SATA HDD tray for sufficient storage. Two PCIe x8 expansion slots are available for add-in cards.
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Product
Open Pluggable Specification-Plus (OPS+) Digital Signage Player With LGA1151 Socket 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q370 And TPM 2.0
OPS700-520
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The OPS700-520 is an Open Pluggable Specification Plus (OPS+) digital signage player. The high-performance signer player is powered by the high-performance LGA1151 socket 8th generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Coffee Lake S) with the Intel® Q370 chipset. This OPS+ digital signage module supports Trusted Platform Module (TPM) 2.0, Intel® Active Management Technology (Intel® AMT) 11.0 as well as Intel Unite® solution for content sharing and collaboration. It comes with two 260-pin DDR4-2400 SO-DIMM sockets that can provide system memory of up to 32GB. The Coffee Lake S-based OPS700-520 offering future-proofed flexibility and performance is among one of the most advanced and powerful digital signage players in the market.
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Product
Switching Unit
ZET 454
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The ZET 454 switching unit is intended for serial switching of 72 circuits of ZET 452 control devices to one of the sixteen sockets. The ZET 452 electric circuits control device is connected to a socket on the ZET 454 switching unit front panel. On the front panel of ZET 454 there also are sockets for tested device circuits connection, which is performed using the adapter harnesses.
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Product
Electrical Button Life Span Tester
IEC60884
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Shenzhen Autostrong Instrument Co., Ltd.
Plugs and the sockets life tester is designed according to the corresponding provisions of the GB2099-96,GB16915-97 and IEC60884-1,used to detect the mechanical life test of the household and similar purposes of the plugs and the sockets products.
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Product
IEC60884-1 Plug Socket Switch Life Tester With 3 Stations
CZKS-4
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Shenzhen Chuangxin Instruments Co., Ltd.
1. This test equipment is designed and manufactured according relevant requirement of Standard IEC60884-1,GB2099.1 and GB16915.1,Mainly used to test the service life of household and similar use plugs and sockets or switches. 2. This machine connect to load cabinet and conduct electrical life test ,normal operation and breaking capacity to plug socket and switch.
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Product
Rear I/O For VPX703, VPX RTM
VRT703A
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The VRT703A is a 3U VPX Rear Transition Module providing I/O expansion for use with the VPX703. The VRT703A provides an easy access to the I/O ports routed to the P1 and P2 connectors of the VPX703. These includes dual PCIe x4, dual USB, RS-232 for both management and payload, dual 1553 ports, JTAG for CPU, dual GbE as well as mSATA socket for storage.
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Product
Single Processor VPX Payload Blade
VP62106
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LinkedHope Intelligent Technologies Co.,Ltd.
VP62106 is a single processor VPX payload blade based on the Intel® 3rd generation CoreTM i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two PCI Express 3.0 x8 lanes in the VPX Data plane for workstation and compute intense applications.Two x8 PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and I/O boards.With a SO-DIMM socket dual channel DDR3 design running up to 1600MT/s, the VP62106 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO-DIMM technology. Moreover, the 3rd generation CoreTM processors offer increased cache size and efficiency as well as instruction set improvements which make the VP62106 a high performance compute engine with outstanding floating point and vector processing performance.
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Product
Multimeters
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Testo's exclusive auto-test setup enables the user to simply turn on the unit, connect the leads, and begin measuring. The testo 760 Digital Multimeter detects the lead connection and prevents switching from V to A or A to V if leads are not in proper socket. This prevents accidentally blowing the meter's fuse because of incorrect connections.
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Product
Enclosure, 50 Module, Hinged Cover Plate, 4" Deep
410112199
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The Enclosure for the 50 module ITA is made of aluminum, painted black and secured to the ITA by eight socket head cap screws (included). The top of the enclosure is a hinged cover plate with quarter turn hardware that provides easy access to the ITA’s wiring when required.
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Product
H009 Module
M4KH009
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H009 modules can operate as a Central Computer Complex (CCC) and/or up to 16 Peripheral Units (PUs) simultaneously, or as a Bus Monitor. In addition, a Concurrent Bus Monitor enables concurrent monitoring of the bus during CCC and PU simulation. The module also supports error injection and detection, and all control parameters and data may be updated in real time. Note: The M4KH009 Module is a "double size" module, and occupies two vertically adjacent sockets in the EXC-4000 carrier Board.
