Sockets
receive conductors.
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Product
Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Test Sockets
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socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Aspen Sockets
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Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Open Top BGA Sockets
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Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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BGA Sockets
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Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Qualification Hardware & Sockets
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Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include: HTOL Boards (Mother and Daughter cards) Burn-In Boards HAST Boards THB (humidity) Boards Burn-In Modules and frames Dynamic Driver cards (Digital, Analogue and Mixed signal) Back Planes Voltage regulator cards Custom electro-mechanical assemblies DUT Cassettes and test Fixtures
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Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Custom Test Connectors and Sockets
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Custom test sockets are traditionally expensive to build and maintain. To reduce these costs, consider: Using rapid prototyping techniques to build a housing. Using replaceable Z-Axis Connectors. Depending on board layouts and compressed height, these sockets or test fixtures can achieve high numbers of mate/de-mate cycles and operate at GHz frequencies.
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Silver Button Sockets
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For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Smart Sockets
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Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the electronic circuitry inside the lid. These activations are counted by the counter IC and displayed in LCD. Let’s say a contact element is rated for 2K insertions. After 2K insertions, this contact element will be replaced by new contact element. Now, the counter has to start the counting from the beginning. To achieve this function, a reset option is included in the electronics circuitry. When reset is actuated, LCD display will go to “0”.
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Socket Probes
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A lot of companies build test sockets. But only our test sockets are populated with our own proprietary probe technology, developed internally. This assures you that when you purchase one of our test sockets, you are using the most advanced interconnect available.
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Pin-Line™ Collet Socket with Solder Tail Pins
Series 0513
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Pin-Line Collet Sockets with Solder Tail Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with solder tail or wire wrap pins. Consult Data Sheet No. 12014 for wire wrap pins. Break feature allows strips to be cut to the number of positions desired.
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Product
Ethernet-GPIB-USB to Serial Interface
Model 9006
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* All interfaces provide full communication with the serial device.* Ethernet port supports VXI-11 and raw socket protocols.* Controllable with Windows PC programs like C, Visual Basic, LabVIEW, VEE, etc that make VISA or SICL calls.* Controllable from MAC/UNIX/LINUX and similar computers with RPC calls.* GPIB port is IEEE-488.2 compatible.* USB port uses Microsoft supplied driver to prevent driver problems with operating system change problems.* Serial port provides RS-232 and 2 or 4-wire RS-485 signals.* Supports devices that generate asynchronous messages, devices that respond when queried and smart devices.* Internal webserver for easy configuration from any browser.* Board runs on 5 to 15 Vdc power.* Includes ICS's VXI-11 and VISA keyboard control programs.* Works with Agilent, NI and Kikisui VISA libraries.
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Open Pluggable Specification (OPS) Digital Signage Player With Socket G2 Intel® Core™ I5/i3 And Intel® HM76 Chipset
OPS870-HM
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OPS870-HM Open Pluggable Specification (OPS) compliant signage player is powered by 3rd Generation Intel® Core™ processors. The high performance OPS870-HM is based on Mobile Intel® HM76 Express chipset and features 3rd Generation Intel Core processors based on the leading edge 22nm process technology. Axiomtek's OPS870-HM is engineered to be installed into any OPS-compliant digital signage platform to enable faster and easier installation, and straightforward upgrading and maintenance. It significantly provides superb graphics performance, full HD content playback, and dual display presentations. Equipped with the OPS870-HM, users can apply a variety of DOOH (Digital Out Of Home) applications with ease!
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Universal PLCC ZIF (Zero-Insertion-Force) Test Socket
Series 537
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Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
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Socket Testers & Adaptors
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Our range of socket testers & adaptors allow users to quickly and simple check the wiring of a socket, clearly identifying polarity faults with and audible buzzer continuously sounding if correct.
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Test Adapter
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Development of a 12-way test and programming adapter from Toptest for ?? The Dash ?? from Bragi, a wireless, intelligent earphone with communication and sensor technology. With the first version of the test adapter, only a purely sequential testing was possible due to the interdependencies of the tests. In version 3.0, the now autonomous tests were brought into a parallel TestStand sequence. In addition, individual sockets were prioritized in order to optimally use the hardware resources. This resulted in a time advantage of 80% compared to the initial situation.
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Camera Module Socket
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Designed for application to all SMD type products, compact camera module clamshell socket provides a connector clip embodying precision in contact, a total interface solution.
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Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, Dual DisplayPort++, HDMI, LVDS, USB 3.0, MSATA, M.2 And Dual GbE LAN
MANO520
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The MANO520 is powered by the LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake), Intel® Pentium® Gold or Intel® Celeron® processor with the Intel® Q310 chipset (Intel® Q370 optional). The Intel® Coffee Lake-based MANO520 is specifically designed for performance-demanding applications with its excellent reliability as well as communication and real-time computing capabilities. The MANO520 supports two 260-pin DDR4-2666/2400 SO-DIMM sockets for up to 32GB of memory. Also, the mini-ITX motherboard features three SATA-600 connectors and one mSATA for additional storage. It is equipped with one full-size PCI Express Mini Card, one PCIe x16 and one M.2 Key E slots for wireless devices such as Wi-Fi, Bluetooth, and 3G/LTE. Moreover, the mini-ITX form factor single board computer features an ATX connector with AT mode auto power function.
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Fanless Embedded System With Intel® Celeron® J1900, HDMI, VGA, 2 GbE LAN, 4 USB, 3 COM And 10 To 34 VDC
eBOX626-842-FL
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The eBOX626-842-FL is the energy-efficient fanless embedded box PC suited for rugged and extreme applications with its extended temperature and wide range voltage capability. The extreme compact box PC utilizes an onboard Intel® Celeron® quad core processor J1900 2.0GHz (codename: Bay Trail-D) to boast both excellent performance and ultra-low power consumption. The ultra-slim fanless embedded computer supports system memory up to 8 GB with one DDR3L-1066/1333 SO-DIMM socket and offers HDMI and VGA display outputs, offering not only high computing capability but also excellent graphics performance. Integrated single-chip design, the brand new ruggedized embedded system is lighter and thinner compared to previous eBOX620 series. Supporting wide operating temperature between -20°C to +55°C and 10 to 34VDC wide DC input voltage, the fanless embedded PC is excellence for wide range of industrial applications. Its passive cooling design also offers quiet, fanless operation with low power consumption, and all at an attractive price point. With full-featured of I/O interfaces, the Intel® Celeron®-based eBOX626-842-FL supports two RS-232/422/485 ports, one RS-232 port, VGA, HDMI, audio, dual Gigabit Ethernet LAN ports, four high-speed USB 2.0, three SMA type connector openings for antenna, 10-34VDC power input connector, and one ATX power switch. One 2.5" SATA HDD drive bay and mSATA are also embedded in the embedded computer to possess sufficient storage.
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COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
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The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
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Tester, US Mains Socket
72-6861
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The 72-6861 is a Receptacle Tester with 3-indicator light. 2nd-Amber indication for ground contact (Open ground) and 3rd-amber indication for neutral contact (Open neutral) not connected, for hot and ground contacts interchanged indication by red and amber. If 2-amber indication occurred, receptacle is wired correctly.
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Socket Phone
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Design for phone device test and system verify.Phone device: CPU,flash,baseband,LPDDR,power IC.etcPitch range from 0.30 to 1.27mmKey material: PEI,Peek,Torlon,PPS.etcContact with top pogo pin
