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Product
COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
Computer on Module
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Product
COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
Computer on Module
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Product
COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
Computer on Module
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Product
COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
COM Express Type 10
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The COM Express Type 10 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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Product
COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
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The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
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Product
COM Express Type 6 Compact Module With 8th Gen Intel® Core™ & Celeron® Processor
CEM521
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The CEM521 is powered by the latest 8th generation Intel® Core™ i7/i5/i3 processor or Intel® Celeron® processor 4305UE (codename: Whiskey Lake-U). It is suitable for harsh operating conditions with an extended operating temperature range of -40°C to +85°C (-40°F to +185°F). The 4K-ready system on module was designed for graphics-intensive Industrial IoT applications including industrial control system, medical imaging, digital signage, gaming machines, military, and networking. The palm-sized CEM521 is packed with a variety of rich features including low power consumption, industrial temperature support and high graphic processing capability. The COM Express Type 6 compact module supports two DDR4-2400 SO-DIMM sockets for up to 64GB of system memory. The power-efficient CEM521 is also integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for excellent graphics performance with a resolution of up to 4K (4096 x 2160 @ 30 Hz). It offers three independent display support through one LVDS, one VGA and one DDI ports for HDMI/DisplayPort.
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Product
COM Express Type 6 evaluation carrier board
ATX-M-CC462-T6
Carrier Board
The ATX-M-CC462-T6 is a fully featured COM Express Type 6 evaluation carrier board designed for use with the WINSYSTEMS Intel® Tiger Lake UP3 COM Express and other COM Express Type 6 modules.
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Product
Chassis Platforms
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Elma offers a comprehensive range of standard, modified standard and custom packaging solutions with integrated backplane, power and cooling for; 19" rack-mount, test/development, and field deployable applications. Supporting the full range of VITA, PICMG and Small Form Factor architectures Elma has configurations based on VME, VME64x, OpenVPX, AdvancedTCA, CompactPCI, CompactPCI-Serial and COM Express.
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Product
Compact Carrier Board
CM22002
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22002 is a compact carrier board which matches the dimensions of a COM Express® Basic module.CM22002 is ideal for space constrained applications, and supports extended temperature ranges of -40℃ to +85℃.
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Product
COM Express Type 6 Prototyping Kit based on Intel® 12th Gen Core™ i5-12600HE
COM Express Type 6 Alder Lake-P
Computer on Module
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Product
Computer On Module
ITX-M-CC452-T10
Carrier Board
The ITX-M-CC452-T10 is an industrial Mini-ITX small form factor Type 10 reference carrier board designed to fully test WINSYSTEMS’ COMeT10-3900 COM Express Type 10 Mini module. The carrier board adheres to the PICMG COM Express specifications providing compatibility with other COM Express mini type 10 modules.
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Product
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
Computer on Module
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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Product
COM Express Type 7 10GbE SFP+ Network Adapter Card
CEI-2x10G SFP+
Network Interface Controller
- Support up to two 10GbE SFP+ interfaces- Inphi CS4227 inside- COM.0 R3.1 Type 7 compliant- Dedicated for Express-VR7
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Product
COM Express Module
CM22202
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22202 is a Type 6 COM Express® module developed by LinkedHope® based on China local x86 architecture ZX® KX-6000 series Processors. This module pinout is compliant with PICMG COM.0 R3.0 specification. CM22202 contains all kinds of high-speed interfaces such as SATA III, USB 3.0 and PCIe 3.0. CM22202 provides dual-channel SO-DIMM, supporting DDR4-2666 MHz memory and the capacity up to 32GB.CM22202 supports KX-6000 series 4 core processors which TDP from 25W to 55W. CM22202 provides high performance computing with balanced power consumption. CM22202 works well in a wide range temperature environment. It is ideal for the high-bandwidth and processing intensive requirements of industrial and edge computing applications.
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Product
COM Express Type 6 Compact Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
CEM313
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The CEM313, a COM Express® Type 6 compact module, is built with the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the COM Express® type 6 module prevails in its excellent graphics performance while supporting DX12.0, OCL 2.0, OGL 4.3 with resolution up to 4K (3840 x 2160 @ 30 Hz). Furthermore, two 204-pin SO-DIMM DDR3L-1600 have been deployed in the CEM313 up to a maximum of 8 GB Overall. With the innovative design of low power consumption, wide temperature range, and seismic resistance, the CEM313 can be served as an excellent solution for graphics-intensive applications over the IIoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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Product
COM Express™ Type 2 Development Baseboard
CEB94000
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The COM Express development baseboard, the CEB94000, supports standard ATX form factor, flexible expansion with PCIe x16, PCIe x1 and 32-bit/33MHz PCI bus. Dual 7 segments port 80 display is reserved for convenient debugging purpose.
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Product
Qseven
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Qseven module is a very small size Computer-on-Module targeting towards low power and mobile applications. The Qseven footprint is smaller than that of COM Express and ETX. The maximum power consumption is no more than 12 watt.
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Product
COM Express basic Type 7 with Intel Atom processor
COMe-bDV7
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The COM Express module COMe-bDV7 based on the Intel Atom processor C3000 series extends Kontron's product family of server-grade COM platforms. The COMe-bDV7 as an entry level platform is as a complementary product to the high performance class COMe-bBD7 equipped with the Intel Xeon processor D-1500 series. The COMe-bDV7 module features scalable CPU performance with up to 16 cores.
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Product
Computer-On-Module
CM22301
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22301 uses Intel® sixth-generation Skylake platform and Core M low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.1GHz and the display output resolution can be up to 4K. CM22301 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. CM22301 supports up to 16GB dual-channel low-voltage DDR3L memory populated onboard, and up to 64GB on-board solid state disk silicon, as benefit the development of ruggedized products for harsh environment applications.As defined by VITA 59 specification, CM22301 provides up to 6 PCIe lanes, enabling flexible functionality expansions, such as NICs, DAQs, video capture and so on. Meanwhile, CM22301 also provides up to date computer interfaces like GbE, SATA3, USB3.0/2.0, HD Audio, etc. CM22301 uses the same 220pin board-to-board connector and Type10 pin out definition as COM Express.
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Product
COM Express Type 6 Development Kit
COM Express Type 6 Starter Kit Plus
Computer on Module
The Type 6 Starter Kit Plus consists of a COM Express Type 6 module with ATX size Type 6 reference carrier board that offers one PCI Express x16 slot with proprietary pinout for DDI adapter card that convert DDI signal to DP or HDMI signal, one PCI Express graphics x16 slot, one PCI Express x4 slot, three PCI Express x1 slots, Serial ATA, VGA, LVDS, USB3.0/2.0, Gigabit LAN and Super I/O. All necessary cables are included.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors (formerly codename: Elkhart Lake)
nanoX-EL
Computer on Module
The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE) as well as Intel® Pentium® and Celeron® N and J series processors (formerly Elkhart Lake) with integrated Intel® UHD graphics at a and high speed interfaces. nanoX-EL modules support LPDDR4 memory with in-band ECC up to 16GB, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
COM Express Type 6 Application Board With LVDS, VGA, DDI, Dual LANs And Audio
CEB94021
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*125 x 95 mini size form factor*2 GbE LANs*SATA-600*LVDS, VGA and DDI*4 USB 2.0 and 2 USB 3.0*2 PCI Express Mini Card slots*3 RS- 232/422/485 and 1 RS-232
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Product
COM Express Type 6 Basic Module With Intel® Xeon® And 6th Gen Intel® Core™ I7/i5/i3 Processor, Intel® CM236/QM170/HM170
CEM500
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The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
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Product
Mini Module
COMeT10-3900
Computer on Module
The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board that contains user-specific I/O requirements.
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Product
COM Express Type 7 10GbE SFP+ Network Adapter Card
CEI-4x10G SFP+
Network Interface Controller
- Support up to four 10GbE SFP+ interfaces- COM.0 R3.1 Type 7 compliant- Dedicated for Express-ID7
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Product
Computer-On-Module
ETX®
Computer on Module
ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
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Product
COM Express Embedded System – LM01
AS-LM01-CME-A
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The LM01 COM Express Embedded System is the core processing “engine” in the USB3 Vision Processing Unit but is available as an unhoused OEM unit, available with a variety of interfaces through the use of its PCIe/104 expansion capability. Using high performance Intel i7 and similar processors and with all the usual standard PC interfaces available, this unit is readily adapted for many embedded system applications.
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Product
COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
Computer on Module
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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Product
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
Computer on Module
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
