SIP
Session Initiation Protocol, Standard Interchange Protocol
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Product
AC/DC - On-board Converter Module
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Mornsun Guangzhou Science & Technology
Mornsun AC/DC On-board Converter, one of the best-selling AC to DC converter power supplies, has a good market in the wholesale of AC to DC converter modules. On-board AC to DC converter modules are more frequently used in emerging applications. MORNSUN is expanding and enhancing its portfolio of board mount AC to DC converters to provide customers with a diverse selection of AC/DC converter module power supply in terms of package configurations (SIP, DIP, open-frame, chassis mount, etc.), input/output voltage options and multiple protections. These PCB mount AC to DC power converter modules cover power levels from 1W to 1000W, featuring compact size, standard or extra wide input voltage range, wide operating temperature range, high reliability, etc. Perfectly meet your design requirements for AC to DC converter power supply modules in different industrial applications.
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Product
SIP-90-4 Test System Interface Probe
SIP-90-4
ICT/FCT Probe
Overall Length (mil): 693Overall Length (mm): 17.60Rec. Mounting Hole Size (mil): 57Rec. Mounting Hole Size (mm): 1.45Recommended Drill Size: 1,45 mm
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Product
SIP-90-3 Test System Interface Probe
SIP-90-3
ICT/FCT Probe
Overall Length (mil): 700Overall Length (mm): 17.78Rec. Mounting Hole Size (mil): 55Rec. Mounting Hole Size (mm): 1.40Recommended Drill Size: #54 or 1.40 mm
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Product
Single-in-Line (SIL / SIP) Reed Relays
Reed Relay
The SIL / SIP reed relay is the industry standard when high reliability and consistent performance are desired in a compact package. Pickering Electronics Series 100 - 110 SIL / SIP reed relays feature the highest quality instrumentation grade reed switches making them suitable for the most demanding applications.
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Product
Single-in-Line (SIL / SIP) Reed Relays From Pickering Electronics
Reed Relay
The SIL / SIP reed relay is the industry standard when high reliability and consistent performance are desired in a compact package. Pickering Electronics Series 100 - 110 SIL / SIP reed relays feature the highest quality instrumentation grade reed switches making them suitable for the most demanding application
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Product
Wireless
Virtual Panels
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Designed with flexible work solutions in mind, the Virtual Panel enables remote users to access the full audio capabilities of the intercom system from anywhere, at any time, and be up and running in minutes without the need for dedicated operator hardware. Individual users will access the intercom via a familiar, modern software panel screen on the chosen device and a SIP connection over standard network (either wired, wireless of a combination of both). Having the audio managed by a SIP connection means the panel users are truly flexible as there is no physical connection to any dedicated hardware - it?s all in the cloud.
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Product
SIP-90-6 Test System Interface Probe
SIP-90-6
ICT/FCT Probe
Overall Length (mil): 656Overall Length (mm): 16.66Rec. Mounting Hole Size (mil): 57Rec. Mounting Hole Size (mm): 1.45Recommended Drill Size: 1,45 mm
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Product
Modules
1x9 BIDI Transceiver Modules
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The module supplies best solution of short-haul 20 km for fiber optical system and link distance. The module with the Differential PECL of 3.3 or 5 Voltage and provide the system designer with products to implement a range of ATM (Asynchronous Transfer Mode) and SONET for Telecommunication. The module was all supplied in the new industry standard 1x9 SIP package style with a Bi-directional BIDI SC ST or FC connector interface.
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Product
UDP Test Tool, Flood Generator, VoIP Readiness Test Tool
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The Multiprotocol Network Tester is a freeware, open source tool which enables you to measure quality of your IP network. It can also be used to generate UDP flood or to simulate UDP DoS attack. SIP call is usually established using a SIP session with a bidirectional RTP stream. SIP and RTP protocols are based on UDP transport protocol. UDP uses a simple transmission model without implicit reliability, ordering and data integrity. Each single UDP packet is transferred independently. The quality of a SIP call depends on delays and loss of IP packets in a network. Long delays lead to large RTP jitter and bad sound quality of a SIP call.
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Product
µHELIX® Test Probes
Series S200, S300, S400, and S500
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Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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Product
Semiconductor Test System
TS-960e
Test System
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Product
High-density Power Drivers
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Gate drivers, FETs and protection circuitry integrated into a single package to drive loads in industrial and home-appliance applications, with increased power density per cm². ST’s high-density power drivers are System in Package (SiP) solutions integrating in compact QFN packages the STDRIVE gate drivers and MOSFET-based power stages, responding to the industrial market trend towards higher levels of integration and lower development costs.
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Product
Digital Matrix Intercom System
Gemini
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A system that interfaces with existing communication assets such as SIP telephones.A way to reduce costs for linking remote sites by using standard IP infrastructure.An intercom system that operates over LAN or WAN or Internet.Works on any terrestrial or satellite-based network.Virtual and hardware operator panels to configure and manage each unit.Private one-to-one, group and conference calls with the ability to manage simple to complex conference and private conversations simply and quickly.Interfaces for telephony, 4 wire, and other audio devices such as Radio base station or Presenter systems.Sophisticated SIP integration for modern telephony interconnection options.Camera Mix interfaces for 6 cameras to/from Engineering and Production.
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Product
Slave Dual Industry Pack Carrier
CPCI-SIP-3
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The new CPCI-SIP-3Module provides a 3U high performance flexible I/Oscheme, that supports industry standard IndustryPacks. Choose from over a 100 different IndustryPacks from Alphi Tech and others. For applicationrequiring low cost, high density I/O or unique combinations, the CPCISIP-3 is the perfectsolution.
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Product
3U CPCI Dual IP Carrier
CPCI-SIP
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The CPCI-SIP module provides a 3U high performance flexible I/O scheme that supports industry standard Industry. PacksÔ. For application requiring low cost, high density I/O or unique combinations, the CPCI-SIP is the perfect solution. The CPCI-SIP is also available with the Industry Pack lines routed to the CompactPCI P2 connector for application that require rear panel I/O.
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Product
Enterprise Session Border Controller
eSBC
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Session Initiation Protocol (SIP) is the communication technology employed to set up and tear down VoIP phone calls
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Product
3U Format CompactPCI (CPCI) Bus IP Carrier
CPCI-SIP-2
Bus Extender
The CPCI-SIP is a 3U format CompactPCI (CPCI) bus IP carrier. The CPCI-SIP-2 provides mechanical support and the electrical interfaces for two single width IP modules, or a double width IP module. Multiple CPCI-SIP-2 boards may be installed in a single system.
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Product
DC Alignment
SEP/SIP
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There are analog phase control type DC power supply type and digital control type inverter energy saving type. We provide the most suitable equipment according to the current capacity and cycle time.If the "start command" is executed from the existing molding equipment, each mode of "alignment-pause-demagnetization" is continuously operated by the program inside the instrument. It is also possible to share an emergency stop signal and output an output current abnormality signal.
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Product
Wireless Protocol Emulation
MAPS
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Message Automation & Protocol Simulation (MAPS™) is a protocol simulation and conformance test tool that supports a variety of protocols such as SIP, MEGACO, MGCP, SS7, ISDN, GSM, MAP, CAS, LTE, UMTS, SS7 SIGTRAN, ISDN SIGTRAN, SIP I, GSM AoIP, Diameter and others. This message automation tool covers solutions for both protocol simulation and protocol analysis. Along with automation capability, the application gives users the unlimited ability to edit messages and control scenarios.
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Product
Dual Industry Pack Carrier Module
CPCI-SIP-rp
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The CPCI-SIP module provides a 3U high performance flexible I/O scheme that supports industry standard Industry PacksÔ. For application requiring low cost, high density I/O or unique combinations, the CPCI-SIP is the perfect solution.The CPCI-SIP is also available with the Industry Pack lines routed to the CompactPCI P2 connector for application that require rear panel I/O.
