SIP
Session Initiation Protocol, Standard Interchange Protocol
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Product
Semiconductor Test System
TS-960e
Test System
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Product
AC/DC - On-board Converter Module
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Mornsun Guangzhou Science & Technology
Mornsun AC/DC On-board Converter, one of the best-selling AC to DC converter power supplies, has a good market in the wholesale of AC to DC converter modules. On-board AC to DC converter modules are more frequently used in emerging applications. MORNSUN is expanding and enhancing its portfolio of board mount AC to DC converters to provide customers with a diverse selection of AC/DC converter module power supply in terms of package configurations (SIP, DIP, open-frame, chassis mount, etc.), input/output voltage options and multiple protections. These PCB mount AC to DC power converter modules cover power levels from 1W to 1000W, featuring compact size, standard or extra wide input voltage range, wide operating temperature range, high reliability, etc. Perfectly meet your design requirements for AC to DC converter power supply modules in different industrial applications.
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Product
Modules
1x9 BIDI Transceiver Modules
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The module supplies best solution of short-haul 20 km for fiber optical system and link distance. The module with the Differential PECL of 3.3 or 5 Voltage and provide the system designer with products to implement a range of ATM (Asynchronous Transfer Mode) and SONET for Telecommunication. The module was all supplied in the new industry standard 1x9 SIP package style with a Bi-directional BIDI SC ST or FC connector interface.
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Product
DC toDC Converters
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Low Cost Single Dual and Triple outputs Isolated Outputs Low Ripple, Regulated Outputs Standard packages and pin outs Custom Designs availableNew Miniature V3 Series features HighVoltage Isolation, SIP and DIP packages
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Product
SIP-90-4 Test System Interface Probe
SIP-90-4
ICT/FCT Probe
Overall Length (mil): 693Overall Length (mm): 17.60Rec. Mounting Hole Size (mil): 57Rec. Mounting Hole Size (mm): 1.45Recommended Drill Size: 1,45 mm
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Product
Signal Chain µModule Receivers
µModule®
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Analog Devices µModule® (micromodule) receivers consist of high performance, high speed ADCs with fixed-gain, high speed amplifiers and antialias filters. Our integrated ADC and driver products include integrated bypass capacitance and simplify the high frequency layout required to preserve ac performance. The board space savings are significant for instrumentation applications such as spectrum analyzers, oscilloscopes ,and communications test equipment, or for communications applications such as high sensitivity receivers, software-defined radio (SDR), or signal intelligence receivers. Our portfolio uses system-in-package (SiP) technology similar to multichip modules (MCM) to integrate components with different technologies, along with passive components to make an integrated subsystem.
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Product
3U CPCI Dual IP Carrier
CPCI-SIP
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The CPCI-SIP module provides a 3U high performance flexible I/O scheme that supports industry standard Industry. PacksÔ. For application requiring low cost, high density I/O or unique combinations, the CPCI-SIP is the perfect solution. The CPCI-SIP is also available with the Industry Pack lines routed to the CompactPCI P2 connector for application that require rear panel I/O.
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Product
Slave Dual Industry Pack Carrier
CPCI-SIP-3
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The new CPCI-SIP-3Module provides a 3U high performance flexible I/Oscheme, that supports industry standard IndustryPacks. Choose from over a 100 different IndustryPacks from Alphi Tech and others. For applicationrequiring low cost, high density I/O or unique combinations, the CPCISIP-3 is the perfectsolution.
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Product
Wireless
Virtual Panels
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Designed with flexible work solutions in mind, the Virtual Panel enables remote users to access the full audio capabilities of the intercom system from anywhere, at any time, and be up and running in minutes without the need for dedicated operator hardware. Individual users will access the intercom via a familiar, modern software panel screen on the chosen device and a SIP connection over standard network (either wired, wireless of a combination of both). Having the audio managed by a SIP connection means the panel users are truly flexible as there is no physical connection to any dedicated hardware - it?s all in the cloud.
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Product
Dual Industry Pack Carrier Module
CPCI-SIP-rp
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The CPCI-SIP module provides a 3U high performance flexible I/O scheme that supports industry standard Industry PacksÔ. For application requiring low cost, high density I/O or unique combinations, the CPCI-SIP is the perfect solution.The CPCI-SIP is also available with the Industry Pack lines routed to the CompactPCI P2 connector for application that require rear panel I/O.
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Product
SIP-90-5 Test System Interface Probe
SIP-90-5
ICT/FCT Probe
Overall Length (mil): 1,000Overall Length (mm): 25.40Rec. Mounting Hole Size (mil): 55Rec. Mounting Hole Size (mm): 1.40Recommended Drill Size: #54 or 1.40 mm
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Product
3U Format CompactPCI (CPCI) Bus IP Carrier
CPCI-SIP-2
Bus Extender
The CPCI-SIP is a 3U format CompactPCI (CPCI) bus IP carrier. The CPCI-SIP-2 provides mechanical support and the electrical interfaces for two single width IP modules, or a double width IP module. Multiple CPCI-SIP-2 boards may be installed in a single system.
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Product
DC Alignment
SEP/SIP
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There are analog phase control type DC power supply type and digital control type inverter energy saving type. We provide the most suitable equipment according to the current capacity and cycle time.If the "start command" is executed from the existing molding equipment, each mode of "alignment-pause-demagnetization" is continuously operated by the program inside the instrument. It is also possible to share an emergency stop signal and output an output current abnormality signal.
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Product
IMS-SIP Network Emulator Software
E6966B
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Wireless telephony networks are increasing capacity for high throughput Internet Protocol (IP) packed-data by utilizing radio access technologies such as LTE and HSPA. Session Initiation Protocol (SIP) and IP Multimedia Subsystem (IMS) are progressively being adopted as part of the network infrastructure to carry traditional wireless telephony services over an all-IP network. SIP provides control of communication sessions whilst IMS is the framework that allows delivery of multimedia services over IP. With this new capability comes the need for developers and operators to move their focus to testing user equipment (UE) in this new network environment.
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Product
802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
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The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
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Product
IQ4 Pipeline Metal Detection
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The IQ4 Pipeline is a robust system designed for both Sterile in Place (SIP) and easy strip down cleaning depending on the application, complying to EN1672-2 hygiene standards. This system is designed to be used with pumped and flowing products such as meat slurries, soups, sauces, jams or dairy.
