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Automated Wafer Handler up to 450mm
GPR-GB7S
The GB7S Robot System employs Genmark’s breakthrough and patented GPR™ Technology to achieve the highest level of performance currently available in an automated wafer handler which is capable of handling up to 450mm diameter wafers. The patented GPR technology enables the servo-controlled robot to interface compliantly and intelligently with misaligned cassettes, FOUPS and process modules, as well as provide software-controlled end-effector deflection compensation during transport of heavier payloads. The unique and patented YAW technology feature of the GPR-GB7S Robot System enables it to access in-line process modules, FOUPS and cassettes from a fixed centralized location, and eliminates the need for radial placement of process and other stations around the robot. The GB7 Robot System can have various arm configurations to accommodate a wide range of SMIF/cassettes front-end layouts.
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Test Handlers
Boston Semi Equipment test handlers are designed for optimum production performance on your test floor.
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Test Handler
M4841
High-Throughput Device Handler for Volume Production Testing of MCUs and DSPs.
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Test Handler
Memory Family
As semiconductors proliferate and continue to increase in complexity, they are found in an ever-expanding array of state-of-the-art applications, including PCs, digital appliances, mobile devices, and automobiles. To meet the demands of this diverse set of end-user requirements and to keep their products differentiated from the competition, device manufacturers continually pursue new technologies, and there are now over 100 IC package types offered. To this end, with time-to-market a critical measure for success, device manufacturers are seeking ways to get better performance from their equipment, while reducing the production time and labor associated with frequent changes in package types.
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Tri-Temp Test Handler
SIA-118 Series
Whether you are testing at room, cold or hot temperatures, our tri-temp test handlers are suited for a wide range of applications, from the basic to the most stringent and demanding test requirements. The SIA-118 series offers an open platform for packages from 3 x 3 mm up to 100 x 50 mm at a temperature range from -55 °C to +125 °C and optional full temperature range from -60 °C to +175 °C. Offering easy and flexible configuration, this tri-temperature handler supports both Kelvin and PTB contactors for SOIC, QSOP, SSOP, QFN, TO, MEMS and other custom packages. It is ideally suited for Engineering, Qualification Lot, and small-to-medium production run with easy migration to full production capability. This is a popular model for custom applications with very low NRE. Powered by a cutting-edge 80 ns/step all integrated controller and modular programming design for easy customization.
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Wafer Level Test Handler
Kronos
Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Test Handler
Logic Family
To meet the demands of this diverse set of end-user requirements and to keep their products differentiated from the competition, device manufacturers continually pursue new technologies, and there are now over 100 IC package types offered. To this end, with time-to-market a critical measure for success, device manufacturers are seeking ways to get better performance from their equipment, while reducing the production time and labor associated with frequent changes in package types.
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Test Handler
JOT M5
Simple, cost-effective way to automate PCB and pallet based testingSafe, reliable product handlingQuick-adjust ease: no product-specific partsFaster handling of smart productsIndustry 4.0 autonomous interconnectivityTruly scalable for growing test needsReusable, application-specific test boxesM-TestBoxes compatible with M1 handlerBoxes are fully independent, just pull out from M5 rack and use in off-line testingFail product separation to integrated magazineSpacious service-friendly constructionErgonomic workspaceTouchscreen UI with base statistics and service capabilityEasy start-stop operabilityAutomated width adjustment
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Die Sorter Handler
4605-HTR
4605-HTR is a MAP Sorter which picks up devices from wafer ring and sorts to tape or bin according to the MAP file created by film frame test handler or prober. 4605-HTR is a high speed handling system, available for 12 inches wafer rings. When used in combination with 4170-IH, 4605-HTR much improves efficiency in testing process of leadless devices as a high speed sorting machine.
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Universal Off-Line Handler
OLS Series
Developed as an economical and versatile solution, it adapts to any offline test application - ICT (In Circuit Test), ISP (Flashing) or FCT (functional). The design of this solution allows the quick and ergonomic change of fixtures , with a change time of less than 3 minutes.
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In-Line / Board Handler
Circuit Check’s in-line board handler fixturing exceed the high performance requirements associated with high-volume production. Circuit Check supports in-line fixturing for all the leading ICT handlers including Keysight 5i, Teradyne TSh Multi-Site, IPTE and Pematech. Circuit Check is the go-to partner for in-line functional test fixtures to speed production throughput.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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High Performance Strip Handler
Rasco Jaguar
Jaguar is designed for high-volume production testing of ICs on a strip format or in device carrier. It is fully automotive qualified for tri-temperature test and the ideal solution for high parallel testing of small packages at short test times, but also for Power and Sensor devices. Due to the integrated vision alignment and high precision linear motors, Jaguar provides high yield and excellent OEE.
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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Modular Gravity Handler For Small Devices
Rasco SO2000
Modular designed gravity handler with various input and output possibilities. SO2000 can handle the smallest possible packages for gravity and provides a broad range of Sensor and MEMS applications.
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Wafer Cathodoluminescence Microscope
Säntis 300
Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Kitless Pick-and-Place Handler
900
Exatron now offers a new breed of Benchtop Pick & Place Handlers: the Model 900 series. The Model 900 is an extremely efficient yet inexpensive PC controlled Pick & Place System
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Compact Wafer Transport with Integral Wafer Pre-Aligner
GB4P
The GB4P Robot System with integral wafer pre-aligner is the most compact robot and pre-aligner package available on the market today for wafer handling applications up to 200mm, standard payload and throughput.Identical in size to Genmark’s original GB4 robot, the GB4P houses a built-in pre-aligner for wafers ranging from 2"- 8" in diameter. The adjustable feature on the pre-aligner allows for simple and fast configuration for different wafer sizes. Engineered for single or dual wafer transport, the GB4P robot is available with an extensive variety of reach and vertical stroke combinations.
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MPI PA Wafer Probers
MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
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Full Wafer Test System
FOX-1P
Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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In-situ Wafer Temperature Monitoring
CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Test Handler
M4171
Advantest’s M4171 single-site handler combines these capabilities in a portable design that is ideally suited for use in engineering environments.
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Wafer Edge Profile Measurement
WATOM
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Automated Fiber Handler
1200
The 1200 Automated Fiber Handler is the first fiber preparation product that enables optical fiber manufacturers to significantly reduce the cost of production measurements by automating the critical optical fiber stripping, cleaning, cleaving and temporary coupling processes.