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Memory Test System
T5835
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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Memory Test System
T5221
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Memory Test Systems
ICs that record and retain data are called memory devices. Our memory test systems are optimized for volume production of memory semiconductors, a market where low-mix high-volume production is the norm, and feature industry-best parallelism (the ability to test a large number of semiconductors at the same time).
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Memory Test Systems
T5503HS2
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Memory Test System
T5833/T5833ES
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Memory Test System
T5830/T5830ES
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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High-Speed Memory Test Solution
UltraFLEX-M
The UltraFLEX-M builds on the advanced test technology and architecture of the proven UltraFLEX test system to ensure high test quality at the lowest cost of test for high-speed memory devices.
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Flash Memory Test System
T5830
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Memory Test System
T5801
Capable of Testing Ultra-High-Speed DRAM Devices, Supporting Next-Generation GDDR7, LPDDR6, and DDR6 Technologies
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High Throughput 1 ns Pulsed IV Memory Test Solution
NX5730A
Precise and fast characterization of new memory, such as spin transfer torque magneto resistive random access memory (STT-MRAM) from DC to high-speed pulsed IV measurement on silicon wafers Apply accurate and high-speed pulsed voltages (down to 1 ns pulse) to magnetic tunnel junction (MTJ) for STT-MRAM and precisely measure the resistance of MTJ Perform all typical MTJ characterization tests in one solution10 to 100 times faster cycle test, such as a bit error rate test (BERT)Capture and visualize MTJ switching waveforms clearly during the writing pulse Dedicated solution with Keysight Technologies’ technical expertise
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Memory Test Software
Teradyne’s customers count on us for our Near Device Under Test (DUT) technology that gives memory device manufacturers a guaranteed performance advantage. A brief description of dynamic memory and storage memory devices will highlight why device manufacturers depend on Teradyne’s memory test solutions.
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Parallel Memory Test Solution
Magnum2
Teradyne’s Magnum 2 test system delivers high throughput and high parallel test efficiency for high performance non-volatile memories, static RAM memories and logic devices.
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DDR4 Pro Memory Test Adapter
This memory test adapter for the RAMCHECK LX includes an extraordinarily rugged test socket for many thousands of insertion/removal cycles.
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Memory Test System
T5511
Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
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Ultra-high Performance Solution for Memory Device Test
Magnum EPIC
Teradyne’s Magnum EPIC is a high-performance test solution for latest generation DRAM devices. These devices are key enablers for technologies like 5G, AI, cloud computing, autonomous vehicles, AR/VR and applications with high definition graphics.
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Memory Test System
T5230
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Memory Test System
T5851/T5851ES
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Prototyping & Test Consulting Services Solutions
Don’t cut corners on the path to quality. We are experts in Design for Test (DFT), Design for Manufacturing (DFM), agile development, prototyping and standards/best practices in many industries. Speak to our prototyping and consulting services experts to ensure you make the right decisions and investments at the start of your project.
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Generator/Analyzer for NFC/EMVCo Manufacturing Test
Micropross MP500 PT1-NFC
Support for ISO 14443 A/B, ISO 15693, MIFARE™, FeliCa™. Measurement correlation with NFC Forum and EMVCo certification test bench. Automated test executive with ready-to-run test sequences. Reader/Writer and Card Emulation modes, resonance frequency measurements supported on same antenna. Embedded analog measurements - LMA, field strength, S11, Q factor, waveform characteristics. Physical parameter/waveshape characteristic definition
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Design for Testability (DFT Test)
Corelis can provide you with design consultation and an analysis of your design for boundary-scan testability. We will review your design and make specific recommendations that if implemented will improve the testability. We can also suggest improvements that will increase test coverage and allow boundary-scan to be implemented in a more cost-effective manner.This service also includes a DFT test coverage analysis that we recommend to do after schematic capture and before PCB layout. At this stage of product development, Corelis provides you with a comprehensive test coverage reports that identifies all of the boundary-scan nets and pins and classifies them as completely tested, partially tested, or not tested. The report also recommends where to add test points (pads) for physical “nails” access if additional test coverage is required.
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Interactive Benchtop Test
Strict time-to-market deadlines make it vital to efficiently debug and validate product designs. Virtual instrumentation provides a unified interface that gives engineers an advantage over traditional box instruments.
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Wireless Device Test
New wireless standards, in addition to rising wireless usage, are increasing wireless device complexity while lowering price expectations. To counter rising costs, manufacturers require test systems optimized for efficiency.
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Scienlab Combined Battery Test Solution
SL1133A
Solution for testing battery cells with an output power up to ±3 kW and a voltage range up to 6 V.
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Flexible Cable, 3.5 Mm (Test Port) To 3.5 Mm
85131E
Achieve phase stability with this 96.5-cm cable when a DUT is connected, with adapter, directly to the test set port
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NI Real-Time Test Cell Reference System
780590-35
VeriStand Full Development License with NI Standard Service , Include 1 Year SSP
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Build-to-Print for Test Systems
Built-to-print / test system replication addresses your internal capacity and capability constraints. Ball Systems has perfected quoting, procurement, planning, assembly, testing, quality, delivery and installation to ensure your testers are on-time and on-budget, and meet design and production standards while keeping open and transparent communication.
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GSM/EDGE Analysis Using NI PXI RF Test Instruments
NI-RFmx GSM/EDGE
The NI-RFmx GSM/EDGE personality is a highly optimized API for performing physical layer measurements on GSM/EDGE cellular standard signals. NI-RFmx GSM/EDGE is completely interoperable with all NI-RFmx APIs. It provides simple access to the most advanced optimization techniques such as multi-measurement parallelism and multi-DUT measurements. The result is extremely fast and high-quality measurements with minimal software development effort.
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VXI Digital Test Instrument
T940 Series
The T940 Series for the VXIbus provides the basis for a complete state-of-the-art digital solution at the subsystem level. The T940 is the solution for both legacy digital replacement and new test stations to be built for digital test including aircraft/ avionics, weapons systems, spacecraft, semiconductors and medical devices.
