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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
Computer on Module
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
AI Application Board
MIO-5355
Single Board Computer
Qualcomm Dragonwing QCS6490/QSC5430 on 3.5" SBC, OS support Yocto BSP, Windows on Arm & Ubuntu. Qualcomm® QCS6490/QCS5430 on 3.5" SBC, support extend operating temperature -20~70°C. Powerful but Low Power with 8x Kryo 670 CPU from 1.9 up to 2.7 GHz + Adreno GPU 643 + up to 12.3 TOPs iNPU.
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Product
Intel® Core™ I3-N305 Processor, Intel® Processor N-Series, And Intel Atom® Processor X7000E Series Pico-ITX SBC
MIO-2364
Single Board Computer
Intel® Core™ i3-N305, N-series N97, and x7000E Series x7211EDDR5-4800 up to 16GBDual independent display: LVDS + HDMIGbE (optional PoE/PD, 802.3at), 4 USB, COM, SMBus/I2CExpansion: M.2 E-Key, M.2 B-KeySupports iManager & Software APIs, WISE-DeviceOn
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Product
3U OpenVPX™ Rugged, Cybersecure & Anti-Tamper Single Board Computer
68ARM2
Single Board Computer
The 68ARM2 is a 3U OpenVPX Zynq® UltraScale+™ Quad-core ARM® Cortex™-A53 MPCore™ based Single Board Computer that can be configured with up to three NAI Smart I/O and communications function modules. Ideally suited for rugged Mil-Aero applications, the 68ARM2 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
Computer On Modules
COM Express Basic
Computer on Module
COM Express Basic is the latest COM 125mm x 95mm form-factor, including Intel core i, Intel 6th Generation and Intel Atom processor. Because of wide range of processors, Intel core i, Intel 6th Generation and Intel Atom processors, COM Express can provides not only high-speed interfaces like HDMI/DisplayPort, PCI Express, SATA and USB 3.0 for volume data transportation, but also LVDS, PCI, and IDE for legacy applications.
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Product
3U OpenVPX ARM Cortex-A9
68ARM1
Single Board Computer
NAI’s 68ARM1 is a 3U VPX ARM® Cortex®-A9-based, Single Board Computer (SBC) that can be configured with up to three smart function modules. Ideally suited for rugged defense, commercial aerospace, and industrial applications, the 68ARM1 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems.
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Product
Extreme Rugged PCI-104 Single Board Computer with Intel® Atom™ Processor E3800 Series SOC
CM3-BT1
Single Board Computer
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3102 with NVIDIA MXM GPU
Industrial Computer
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Product
PCIe-to-MXM adapter supporting ADLINK Mobile PCI Express Modules with NVIDIA® Quadro® embedded GPUs
EGX-MXM-AD
PXI Express Module
The EGX-MXM-AD is an PCIe adapter supporting ADLINK NVIDIA® Quadro® MXM 3.1 Type A, Type B, and Type B+ GPU modules for quick validation and early development purposes on your AI applications. The following modules are supported: EGX-MXM-P1000, EGX-MXM-P2000, EGX-MXM-T1000, EGX-MXM-RTX3000, and EGX-MXM-RTX5000. A reference thermal solution is available.
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Product
High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
Industrial Computer
The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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Product
Single Board Computers
Single Board Computer
NAI offers a comprehensive line of adaptable, 3U cPCI, 3U VPX and 6U VME, rugged Single Board Computers (SBCs) specifically designed for harsh, SWaP-constrained environments in a range of demanding, embedded computing applications for the defense, commercial aerospace and industrial applications. These Commercial Off-the-Shelf (COTS) and modified COTS SBCs are based on the latest Intel®, NXP (PowerPC™), and ARM® Cortex®- A9 processors, each delivering unique advantages in deployed applications.
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Product
OSM R1.1 Size-L Module Based On NXP® I.MX93 Series Processor
OSM-IMX93
Computer on Module
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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Product
COM Express
Computer on Module
COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board.
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Product
Computer-On-Module
Qseven®
Computer on Module
Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
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Product
OSM R1.1 Size-L Module Based On MediaTek Genio 510 Series Processor
OSM-MTK510
Computer on Module
The OSM-MTK510 is an OSM R1.1 Size-L module featuring the advanced MediaTek Genio 510 series processor. Equipped with a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, it boasts an impressive MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. This module excels in providing edge AI processing at ultra-low power consumption.
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Product
SMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35
LEC-PX30
Computer on Module
LEC-PX30 based on power-efficient quad-core Arm® Cortex®-A35 SoC is a low-power, low-cost, entry-level, small-sized SMARC rev 2.0 module. For applications, such as IoT controllers, IoT gateways, wearable and mobile industrial devices, basic HMI, sensor concentrators, requiring good computing performance at low power consumption (1.5W- 5W) and Linux Yocto capability, LEC-PX30 is an ideal solution.
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Product
Intel Core Ultra Processors (Code Name: Panther Lake)
MIO-5381
Single Board Computer
Intel Core Ultra Processors, up to 14 Cores, TDP 28W/15WDual Channel DDR5-7200 up to 128GB, with IBECC support4 simultaneous displays: eDP + 2x HDMI + USB-C with DP Alt.2x LAN, 6x USB (incl. 1x USB4), 4x UART, 2x CAN-FD, 8bit GPIO, I2C(*SMBus)4x M.2 Expansions: E-Key 2230, B-Key 3052, 2x M-Key 2280Supports Windows 10/11 LTSC & Ubuntu 24.04 LTS, embedded software APIs, DeviceOn Remote Management, Robotic SuiteSupport EdgeBMC for OOB(Out-of-Band) remote control management
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Product
PCI Express® Bus to 3U PXI Express™ Chassis Expansion Kit
PCIe-PXIe-8565
PXI Express Module
Includes PCIe-8560 peripheral card, PXIe-8565 3U system module, and ACL-EXPRESS cable in 1, 3, or 7 meter lengthsCompliant with PXI-5 PXI Express hardware specification Rev.1.0 and PCI Express Base Specifications Rev. 1.0a250 MB/s maximum system throughput
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Product
MXI-Express Cable with Communication Levels up to Gen 3 x8
779500-07
MXI Express
MXI-Express Cable, Gen 1 x1, Copper, 7m
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Product
3.5" Single Board Computer
RSB-4220
Single Board Computer
The RSB-4220 series comprises RISC SBCs with integrated TI Sitara AM3352 Cortex-A8 processors. Units offer 2x gigabit Ethernet, 5x serial ports, 4x GPI and 4x GPO. For industrial applications, the serial port & GPIO feature rugged ESD and isolation that protect the system from unstable power damage. Also, RSB-4220 has multiple power inputs and operating temperature support, and even supports a single channel 18-bit LVDS with up to 1366 x 768 resolution. It is an ideal solution for automation control such as smart grid, and machinery automation applications.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MVP-6000 Series
Industrial Computer
ADLINK's newly introduced MVP-6000 Series of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor (Code name: Skylake), provides one PCIe Gen3 x16, one PCI slot, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.
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Product
MXI-Express Cable with Communication Levels up to Gen 3 x8
782317-05
MXI Express
MXI-Express Cable, Gen 2 x8, Copper, 5m
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Product
Computer On Modules
COM Express Compact
Computer on Module
Advantech COM-Express Compact includes Intel core i, Intel 5th Generation, Intel atom processor, which are all designed with low power consumption processors. They perform the same functions and same pin definitions as the COM-Express Basic module but with smaller board dimensions of 95 x 95 mm. And COM Express Compact series provide from Intel core i, Intel 5th Generation, Intel atom processors, and is the best solution for mobile applications.
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Product
Power Line Communication (PLC) Module For Single Board Computer
MIOe-PLC
Single Board Computer
Dual QCA7006 for EVSE / Charging Station sideEthernet Host Interface, SPI OptionalExtended Operating Temperature -40~85° C
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
Computer on Module
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Product
PXIe System Module: Single Port (x8), Gen 3
M9022A
PXI Express Module
The M9022A is a PXIe System Module and is installed in the system slot of a PXIe chassis. When combined with an appropriate host adapter, it will provide a high data BW connection between the host PC and the chassis. The module can also be used with an M9037A PXIe embedded controller to interconnect two chassis in a multi-chassis system.
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Product
OSM Size-L Module With NXP® I.MX8M Plus Series
OSM-IMX8MP
Computer on Module
The OSM-IMX8MP is an OSM R1.1 Size-L module featuring NXP® i.MX 8M Pluss series processor with 4-core Arm Cortex-A53 and M7, up to 8GB LPDDR4L memory and up to 128GB eMMC storage. With its in-SoC 2.3 TOPS NPU and Vivante GC7000UL graphics, the module is made for edge solutions needing on-device AI processing at ultra-low power.
