Ground Bond
Checks a ground circuit's ability to handle fault current in the event of insulation failure.
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Product
Type 39 CompacFrame Development Platform, 1 - 4 Slot 3U VPX Power And Ground Backplane
39P01BWX6ZY2VCC0-Tx
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Elma’s slimline CompacFrame is the next-generation platform designed to accelerate development and test of Plug-In Cards (PICs). The 3U card cage in the platform is tilted upward by 5º for easier card access and accommodates backplanes up to 4 slots.
