Flash Device
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Flash Storage Device
Axiomtek provides various industrial-grade flash storage device for customers to simplify and shorten the system design time.
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Semiconductor Memory Tester
T5851
Advantest Corporation has introduced the T5851 system, designed to provide a cost-effective test solution for high-performance universal flash storage (UFS) devices and PCIe BGA solid-state drives (SSDs) memory ICs in high demand by makers of low-power, mobile applications such as smart phones, tablets and ultra-portable laptops. The flexible T5851 tester is available in both production and engineering models. This allows the system to be used for reliability and qualification testing as well as test-program development or, when equipped with an automated component handler such as Advantest''''s M6242, high-volume production. As a fully integrated, system-level test solution, the T5851 provides multi-protocol support in one tool while its tester-per-DUT architecture and proprietary hardware accelerator allow it to achieve industry-leading test times.
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Flash Memory Test System
T5830
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Flash ISP Feature, GTE 10.00p
K8219A
The Flash ISP feature enables in-system programming that is usually executed through a flash player application that drives the MCU to execute the programming onto the flash device.
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Location Devices
Flash Pinger is a small battery powered acoustic transmitter as well as an optical flashing recovery device. Multiple settings allow for selection of flashing, timing, and frequency options for use in a variety of different applications.
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Debug probe for ARM Cortex processors
USB Multilink ACP
P&E’s USB Multilink ACP is a debug probe which allows a PC/laptop access to JTAG/SWD on ARM Cortex devices from several manufacturers (see complete list below). It connects between a USB port on a Windows machine and the standard debug connector on the target. The product photos to the left of this page show how the headers can be accessed by simply flipping open the plastic case. Ribbon cables suitable for a variety of architectures are included. By using the USB Multilink ACP, the user can take advantage of the debug mode to halt normal processor execution and use a PC to control the processor. The user can then directly control the target’s execution, read/write registers and memory values, debug code on the processor, and program internal or external FLASH memory devices.
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High Speed Pick and Place Handler
Commander 2000
At throughput rates in excess of 2000 Units per Hour the HT Commander 2000 system provides unparalleled performance for the production handling and programming of flash memory devices or modules.
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Memory Test System
T5833/T5833ES
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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PLD ISP Feature, GTE 10.00p
K8220A
The PLD ISP feature allows the test developer engineer to specify a configuration bitstream file in VCL digital test file, much like programming a Flash memory device. The PLD ISP feature supports multiple PLD configuration data formats are supported including. Serial Vector Format (SVF), Standard Test And Programming Language (STAPL), Jam, Jam Byte Code (JBC) object files.
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Memory Test System
T5835
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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PLD ISP Feature, GTE 10.00p
K8220B
The PLD ISP feature allows the test developer engineer to specify a configuration bitstream file in VCL digital test file, much like programming a Flash memory device. The PLD ISP feature supports multiple PLD configuration data formats are supported including. Serial Vector Format (SVF), Standard Test And Programming Language (STAPL), Jam, Jam Byte Code (JBC) object files.
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FPGA-Based Ultra-Fast Flash Programmer
XJFlash
XJFlash is an FPGA-based advanced and innovative method that uses JTAG for high-speed in-system programming (ISP) of flash memories – all serial and parallel flash devices are supported. The most common use of XJFlash is programming the SPI/QSPI NOR flash used to configure an FPGA.
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JTAG USB Controller
NetUSB-1149.1/E
The NetUSB-1149.1/E (4 TAPs) is an advanced USB 2.0 and LAN-based controller that can be used in the testing and/or in-system programming (ISP) of devices, boards, or systems compliant with the IEEE-1149.1 standard. The NetUSB-1149.1/E controller supports concurrent (gang) testing and in-system programming of CPLDs and Flash devices at TCK rates of up to 80MHz.The controller connects to the computer either through the USB interface or LAN interface for easy installation at nearby or remote locations. Other features include signal delay compensation for long cable lengths to the UUT, TAP signals, and GPIO discrete signals which are individually programmable from 1.25V to 3.3V, programmable slew rate control and pre-power up test for shorts between power and ground traces on the UUT.
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Universal Automated Programming System
4900
The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
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Flash ISP Feature, GTE 10.00p
K8219B
The Flash ISP feature enables in-system programming that is usually executed through a flash player application that drives the MCU to execute the programming onto the flash device.
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High Speed Device & Flash Programmer
JT 2147 QuadPOD
The JT 2147 QuadPOD high speed device programmer and flash programmer comprises JT 2148 transceiver and four independent, programmable JT 2149 TAP PODs and provides signal conditioning for the DataBlaster series of boundary-scan controllers. Used for gang, parallel, fast testing / Programming of devices.TAP pods can be housed integrally within the transceiver or they can be detached and reconnected via the (optional) one meter extension cable. The JT 2148 transceiver is available in standard (/10) or industrial (/13) variants. The /13 variant includes a SCSI cable splitter to allow system integrators to use flat ribbon cables into the transceiver itself which often simplifies fixture building.A fixture-embedded variant of the JT 2147 is available as part reference JT 2147/FXT. This unit integrates the function of the transceiver and four pod onto a single assembly. This variant can also support 64 DIOS channels and SCIL functions (see more images below for a picture of the JT 2147/FXT).
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Flash Point Testers
Flash point is the lowest liquid temperature at which a test flame causes sample vapors to ignite. Fire point is the temperature at which the test flame causes the sample to ignite and remain burning for ≥5 seconds.
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Flash In Module
FIM Series
Axiomtek's FIM (Flash in Module) series is designed into ATA protocol type with compatible IDE standard interface based on flash memory technology. This flash module is offered with various capacities ranging from 128MB up to 4GB and can operate under industrial temperature range goes from -40°C~85°C in the harsh operating environments. The features of reliability, high performance, cost-effective and easy-to-integrate designs make FIM series a perfect solution over traditional storage devices.
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Flash Point Tester
Weshine Electric Manufacturing Co., Ltd
Closed flash point tester, when the test sample is used in a closed environment (such as transformer oil), to determine the closed flash point value of petroleum products. Use touch screen instead of keyboard operation, adopt foreign advanced technology, large LCD screen LCD full Chinese display man-machine dialogue interface, full screen touch key prompt input, convenient and fast, open, fuzzy control integrated software, modular structure, in line with national standards, the United States, EU and other standards.
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AC Flash Tester
THPG
Very Heavy Duty with high milliamp capacity for properly testing motors and windings.
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Industrial Flash & Memory Solutions
Advantech provides a full range of industrial storage module, memory module, and embedded I/O module.
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Fiber-Optic Devices
Understanding that fiber-optic devices are key devices for building global information networks, Renesas has applied its advanced R&D, design, development, and quality management expertise to creating a diverse portfolio of products for a wide range of fiber-optic communications applications.
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Collaboration Devices
VIA family of True-Collaboration™ solutions: VIA Collage for more complex meeting spaces and VIA Connect PRO for huddle spaces and small to mid-sized meeting rooms.
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Flash Chromatography Systems
Teledyne LABS’ is a leader in the research, development and manufacturing of flash chromatography. The advantages of automated flash chromatography are many. It’s easy, fast, relatively inexpensive, requires minimal development time, uses less solvent, and offers more exacting results. These advantages make flash one of the most popular techniques for purifying pharmaceutical intermediates, as well as final organic products. It is also widely used in natural products research.
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Flash Vs. Scan
A LiDAR system can observe the complete field of view (FOV) at once, called Flash systems. Flash typically works well for short to mid-range (0-100m), and by capturing the complete scene at once also objects with high relative speeds can be detected properly. Another implementation is to focus on a subset of the FOV, consequentially look at the next subsets, until the complete FOV is covered, called Scanning. Scanning can focus the light on the subset instead of the full FOV, and therefore can do object detection at a longer range compared to Flash.
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Wireless Devices
Schweitzer Engineering Laboratories, Inc.
Wireless devices use radio signals to communicate and pass data over the air, eliminating the need for traditional cabling.
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Measurement Devices
In addition to the critical role data loggers play in a data-acquisition system, there are other types of measurement devices. Some measurement devices are used to increase the number of terminals that data loggers can use, which enables them to measure more sensors or control more external devices.
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Loading Devices
Educated Design & Development, Inc.
Built-in fans provide sufficient coolingSelf-contained unit eliminates hazards due to exposed wiringFine tuning mechanism allows for ultra precise measurementsUnits are on casters, providing a portable test station!
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Intelligent Power Devices
Intelligent Power Devices have built-in peripheral and protection functions, and support system reliability improvement and unit downsizing. This device lineup can support a variety of automotive system requirements and includes intelligent power switches, thermal FETs, MOSFET drivers, and a motor driver.
