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Cryogenic Applications
Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe card as well as DUT probing solutions. These custom cryogenic probe card solutions are widely used to test Space, Military, Medical and Quantum Computing products. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovative custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cableout designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
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PXI 8-Slot BRIC Matrix, 2A 1-Pole 525x4, 7 Sub-cards
40-568A-107
The 40-568A-107 is a PXI 1-pole 525x4 matrix in BRIC8 format and is part of a range of high density matrix modules able to switch up to 2 A or 300VDC/250VAC. The 40-568A BRIC modules are available in 2, 4 or 8-slot PXI sizes to suit most high performance PXI Matrix requirements, constructed using high quality electromechanical relays for high switching confidence.
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Cable, 25 Pin 1.27mm Pitch Micro-D, Female to Unterminated, Cut Ends, 1m
A025CFR-C-5A100
This 1m long female 25-Pin Micro-D to unterminated (with cut ends) cable assembly is constructed from 18/0.1 (26 AWG) copper wiring with PVC insulation and screening to minimise crosstalk. Screwlocks are provided to secure the connector to its associated product. This cable assembly is suitable for high density applications including connection to Pickering's LXI DIO/Trigger port.
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PXI/PXIe RF Matrix, 8x4, 300 MHz, 50 Ω SMB With Loop-thru
40-729A-001-L
The 40-729A-001-L (PXI) and 42-729A-001-L (PXIe) are 8x4 50 Ω RF matrices with SMB connectors and Y-axis loop-thru. The 4x-727A/728A/729A range are high density RF matrix modules suitable for switching up to 300 MHz in 50 Ω or 100 MHz in 75 Ω. They are available in 50 Ω or 75 Ω versions with SMB connectors or in 50 Ω versions with a multiway connector.
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PXI 12-Slot BRIC Matrix, 88x8 2-Pole (4 sub-cards)
40-562B-322-88X8
The 40-562B-322-88X8 is a high density BRIC12 matrix module with a size of 88x8 with 2-pole switching. It is part of a range of BRIC matrices available in 2, 4, 8 or 12-slot formats to suit high performance PXI matrix requirements and is constructed using instrumentation quality reed relays.
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High Density Mini-Modular Connectors
N Series
Smiths Interconnect’s N Series mini modular, high density connectors employ a do-it-yourself system based on the building block principle. They offer a variety of combinations available in a single connector frame. Therefore, the user is capable of selecting the connector that fulfills the exact requirements with off-the-shelf components.
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Programmable Power Supplies
GENESYS+™ Series
Utilizing embedded microprocessor technology to provide advanced performance and functionality, the GENESYS+™ series has the highest power density and lightest weight available for its size with a comprehensive set of user-friendly interfaces.
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PXI High Density MUX 94-Channel 1-Pole
40-640-022-94/1
This series of high density multiplexer modules feature a choice of switching configurations. Typical applications include signal routing in ATE and data acquisition systems. The multiplexer module is available as a 47-channel 2-pole, 94-channel 1-pole or 47-channel 1-pole with screened relays. Connections are made via a front panel 96-pin connector. It may be operated as a conventional multiplexer with break-before-make action when a new channel is selected. In addition multiple channels may be simultaneously selected (not available for this 1-pole version).
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PXI 8-Slot High Density 2A BRIC Matrix, 203x8 2-Pole (7 Sub-cards)
40-573-102-203X8
The 40-573-102-203x8 BRIC is part of a range of high density matrix modules able to switch up to 2 A at 240 VDC/250 VAC. They are available in 2, 4 or 8-slot sizes to suit most high performance matrix requirements, constructed using quality electromechanical relays for high switching confidence.
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PXI/PXIe MEMS Optical MUX, 4-Channel, Multi-Mode
40-850A-214-M62.5
The 40/42-850A-214-M62.5 is a PXI/PXIe 4-channel multiplexer with SC/PC connectors and is part of Pickering's range of PXI Fiber Optic MEMS Switching modules. They are available in many high density formats with a choice of different connector styles to suit most applications: FC/APC (for optimal performance), FC/PC and SC/PC for general applications and LC and MU for high density applications. They are also available with an optional hardware interlock which, when activated, will return all optical switches to their default unpowered state.
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PXI 12-Slot BRIC Matrix, 242x8 1-Pole (11 sub-cards)
40-562B-321-242X8
The 40-562B-321-242X8 is a high density BRIC12 matrix module with a size of 242x8 with 1-pole switching. It is part of a range of BRIC matrices available in 2, 4, 8 or 12-slot formats to suit high performance PXI matrix requirements and is constructed using instrumentation quality reed relays.
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PXI Very High Density MUX 10 Chan 16 Pole
40-675-002-10/16
The 40-675 series of very high density low cost multiplexer modules are available in a versatile range of switching configurations. The modules are supplied pre-configured in one of six multiplexer modes suitable for signal routing in high channel count ATE and data acquisition systems. The modules use high quality electromechanical signal relays allowing each channel to switch current up to 1A at 150VDC/100VAC. Connections are made via a front panel 200-pin connector.
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Standard Step Tablets, Gray Scales & Density Reference Charts
Standard Step Tablets, Gray Scales & Density Reference Charts are available in a wide variety of patterns, designs and sizes to fit a multitude of today’s application needs. Our gray scales and density patches are measured on a variety of NIST traceable instrumentation, including some of the most sophisticated microdensitometers available to the industry. They are imaged on either Photo Paper (RM) or Film (TM) to function for reflective or transmissive applications.
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PXI/PXIe MEMS Optical Switch, Dual Insert/Bypass
40-860A-222-M
The 40/42-860A-222-M is a PXI/PXIe dual insert/bypass switch with SC connectors and is part of Pickering's range of PXI Fiber Optic MEMS Switching modules. They are available in many high density formats with a choice of different connector styles to suit most applications: FC/APC (for optimal performance), FC/PC and SC/PC for general applications and LC and MU for high density applications. They are also available with an optional hardware interlock which, when activated, will return all optical switches to their default unpowered state.
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PXI 4-Slot BRIC Matrix, 276x4, 1-Pole (3 sub-cards)
40-560B-021-276X4
The 40-560B-021-276x4 is an ultra high density matrix module and is part of our range PXI BRIC matrices. They are available in 2, 4, 8 or 12-slot sizes to suit high performance PXI switching requirements and is constructed using instrumentation quality reed relays.
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PXI/PXIe Power Relay Module, 6xSPDT, 20 Amp
40-166-101
The 40/42-166-101 is a PXI/PXIe high density power relay module with 6xSPDT switches rated at 20A. The 40/42-166 range is available with SPST, SPDT or SP4T switching configurations. It uses power relays which are suitable for switching loads up to 20A at 240VAC (SPDT & SP4T versions) or 30A at 277VAC (SPST versions).
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Optical Active Module
UPM (Universal SFP-Typed Power checker Module) provide very high productivity for power checking work on high density fiber optic systems and devices for FTTH, CWDM-PON and local network systems. UPM can measure optical power intensity.
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1U Rackmount Network Appliance Platform With LGA1150 Socket Intel® Xeon® E3/Core™ Family Processor, Intel® C226 And Up To 24 LANs
NA570
NA570 1U rackmount Network Security Platform, supports the 4th generation Intel® Xeon® E3 / Core™ processor family, formerly codenamed "Haswell". NA570 offers greatly improved performance and reduced power consumption base on the new Intel architecture marked improvements in power efficiency and performance. The system supports up to 32GB DDR3 1600 non-ECC / ECC (only NA570) memory. NA570 support 4 pairs of LAN Bypass function. Bypass ports allow users to experience uninterrupted network traffic even if a single in-line appliance hangs or sudden shutdown. Expandable LAN Modules via the PCIe 3.0, support up to 24 GbE ports, or up to 4 ports at 10GbE, and a future upgrade to 40GbE, port density and optional networking ports to suit your demands.
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PXI 8-Slot BRIC Matrix, 2A 1-Pole 176x8, 4 Sub-cards
40-567A-104
The 40-567A-104 is a PXI 1-pole 176x8 matrix in BRIC8 format and is part of a range of high density matrix modules able to switch up to 2 A or 100VDC/70VAC. The 40-567A BRIC modules are available in 2, 4 or 8-slot PXI sizes to suit most high performance PXI Matrix requirements, constructed using high quality electromechanical relays for high switching confidence.
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Tilera GX72 Processor AMC, 72 Core
AMC740
The AMC740 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network. Each tile consists of a full-featured, 64-bit processor core as well as L1 and L2 cache and a non-blocking Terabit/sec switch. The high processing density and high internal bandwidth of the GX72CPU make it ideal for intensive computing tasks.
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Modular UPS
PM SERIES 10 - 2080 kVA
PM Series is a scalable, redundant Modular UPS system designed to cost effectively provide high level availability for high density data centers and critical applications. True Online Double Conversion and advanced DSP control technology. Modular Architecture can scale power and runtime as demand grows or as higher levels of availability required. Combines the modular design with the N+X parallel redundancy technology.The maximum capacity of a single cabinet is 520kVA. Cabinets can operate in parallel configuration to build a system of up to 2080kVA.
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PXI/PXIe Very High Density Multiplexer, 10-Channel, 16-Pole
42-675B-002-10/16
The 40-675B-002-10/16 (PXI) and the 42-675B-002-10/16 (PXIe) are 10-channel, 16-pole multiplexers and are part of our range of very high density low cost multiplexer modules. These modules are suitable for signal routing in high channel count ATE and data acquisition systems.
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BGA Interposer, LPDDR4 200-ball, 2-wing For Logic Analyzer, Connects To 61-pin ZIF
W6601A
The W6601A LPDDR4 2-wing BGA interposer for LPDDR4 200-ball BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A logic analyzer module it is compatible with. The W6601A is the smallest BGA interposer for LPDDR4 200-ball DRAM capable of capturing simultaneous read and write traffic at data rates in excess of 3.2 Gb/s. U4208A and U4209A probe/cables connect W6601A LPDDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W6601A BGA interposer wings. Refer to the W6601A data sheet for complete list of LPDDR4 signals probed with the W6601A.
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PXI 12-Slot BRIC Matrix, 378x12 1-Pole (9 sub-cards)
40-558-121-378X12
The 40-558-121-378x12 matrix is part of a range of BRIC ultra-high-density large PXI matrices are available in 2, 4, 8 or 12-slot PXI sizes to suit all high-performance matrix requirements and are constructed using Pickering Electronics' 4mm x 4mm instrumentation quality reed relays.
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SIMRC - 8 x 2 Matrix 2-Pole
1030-R-8-2-2-5/1D
Our small format embedded switching (SIM relay) cards offer a choice of switching configurations using low cost industry standard SIM connectors. They free the designer from the detail of routing complex switching circuits, you may select from a wide range of cards using the built in RS-232 and I2C interfaces. These low-cost embedded switching cards are intended to be mounted on to a simple motherboard. They may be used to construct very high density switching networks. SIM based switching cards also allow for very simple in-field maintenance.
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160 Pin DIN Connector & Cable Accessories
The 160 Pin DIN connector is used on switching products to provide a high density 2A connector solution. If you would like to develop your own cabling solutions, we offer mating connectors and connector hoods that allow you to create either your own cable based solutions, or a PCB header solution. Connector Blocks directly terminate the module connector and convert the connection to arrays of screw terminal blocks, or you can select to use a remote DIN rail mounted breakout to terminate the cables at the end of a cable assembly. You can also try our Cable Design Tool to graphically design a customized cable assembly.
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PXI 8 Slot BRIC Solid State 128x8 1-Pole (4 sub-cards)
40-563A-121-128X8
This version of our BRIC is part of a range of high-density PXI matrix modules. These modules are available in 2, 4 or 8-slot PXI sizes to suit all high performance PXI matrix requirements and are constructed using solid-state switches. With this high level of switching density, these PXI matrix modules allow a complete Functional ATE system to be housed in a single 3U PXI chassis. These BRIC matrix modules allow the use of lower cost 8 or 14-slot PXI chassis.
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PCI High Density Pecision Resistor Card, 6-Channel, 4Ω To 11.4MΩ
50-298-053
The 50-298-053 is a high density programmable resistor card with 6 channels which can be set between 4Ω and 11.4MΩ with 1Ω resolution The 50-298 range provides a simple solution for applications requiring accurate simulation of resistive sensors. The 40-298 is available in a variety of resistance ranges and resolution capabilities that meet the needs of most functional test systems. It is particularly well suited to applications such as the testing of engine controllers where resistive sensors provide information on parameters such as temperature.
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Solution Dispenser
1550A
The CHI1550A solution dispenser is designed for making high density and high accuracy solution arrays. Solution arrays are widely used in chemical, biological and medical applications. The solution dispenser consists of a high resolution three dimensional positioner, a piezoelectric jetting device, and a sample platform.
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Power Supply System
PL506
The PL 506 is a high sophisticated, high density, programmable 6-channel floating low-voltage power supply system. Using the remote monitoring and control features either via USB or Ethernet it can be used to supply external load-channels with high power consumption also over long distances. Up to 3kW (3Ubox) DC output power can be provided.
