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Product
Xeon E3-1125 Processor AMC, Fabric Mix
AMC723
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The AMC723 is a Processor AMC (PrAMC) in a single module, mid size AdvancedMC™ (AMC) form factor based on the Intel® Corei Processor with Cave Creek PCH.
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Product
DIN75200 Interior Fabric Horizontal Burning Test Equipment
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Shenzhen Chuangxin Instruments Co., Ltd.
DIN75200 Interior Fabric Horizontal Burning Test Equipment
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Product
Fabric Pneumatic Bursting Tester
TF142C
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TESTEX Testing Equipment Systems Ltd.
Fabric Pneumatic Bursting Tester, to determine the bursting pressure of fabrics uses pneumatic test method, including knits, woven fabric, non-woven fabric, laminated fabric and other craft-made fabric.A test specimen is clamped over an expansive diaphragm by a circular clamping ring, increasing compressed air pressure is applied to the underside of the diaphragm, causing distension of the fabric until the test specimen bursts, the bursting strength and distension are determined.
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Product
CompactPCI CPSB 2.16 6U 8 slot, 6 w/cPCI, 2 Fabric, no P2
107PS21608-0257R
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CompactPCI CPSB 2.16 6U 8 slot, 6 w/cPCI, 2 Fabric, no P2, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
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Product
Easy-to-assemble and Collapsible RF Test Enclosure With Fabric Shielding, ≥ 90 DB Isolation, 300 MHz - 18 GHz
dbTENT
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The dbTENT is an easy-to-assemble, store and transport high-performance RF test enclosure. Whether you need to make measurements in the field or in the lab, the dbTENT provides superior 90 dB of isolation over a wide frequency range thanks to its patented double layer conductive fabric design. Featuring an interchangeable customisable I/O panel, the dbTENT meets all your needs for non-permanent isolated testing. With a setup time of only minutes, the dbTENT will get you ready for testing instantly in a wide variety of environments.
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Product
PCI to Star Fabric Module
51-921-001
Remote Control Interface
This module resides in the Slot 1 position of a PXI chassis and interfaces to the backplane of the PXI chassis. When located in a generic peripheral slot, it can be used to drive two extension PXI chassis.
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Product
Yarn Count Tester
TY361
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TESTEX Testing Equipment Systems Ltd.
Yarn Count Tester, automatically calculates count systems used for sliver, roving and yarn, and can also be used for fabric yield. Yarn Count Tester consists of an accurate electronic balance and built-in calculating program.
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Product
TR H4x/msd-RCx, 3U VPX Server board
TR H4x/msd-RCx
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TR H4x/3sd-RCx is a compute intensive rugged server board. It features a processor with 12-cores, large memory capacity, local storage and has 40G and 10G Ethernet interfaces for high throughput fabric connectivity.
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Product
Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Product
4-Channel 200 MHz, 16-bit A/D with Virtex-7 FPGA - XMC
Model 71760
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- Complete radar and software radio interface solution- Supports Xilinx Virtex-7 VXT FPGAs- GateXpress supports dynamic FPGA reconfiguration across PCIe- Four 200 MHz 16-bit A/Ds- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Advanced reconfigurability features- VITA 42.0 XMC compatible with switched fabric interfaces- Optional user-configurable gigabit serial interface- Optional LVDS connections to the Virtex-7 FPGA for custom I/O- Supports GateXpress® FPGA-PCIe Configuration Manager- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
NFPA 701-1 Flammability Tester
TF320
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TESTEX Testing Equipment Systems Ltd.
NFPA 701-1 Flammability Tester, to determine the ignition resistance properties of draperies and other hanging fabrics according to test method NFPA 701#1, and it is suitable for single-layer or multi-layer fabrics, but not suitable for fabrics with density larger than 700g/m2 (21oz/yd2).
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Product
Process EDXRF Spectrometer
NEX LS
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Applied Rigaku Technologies, Inc
Featuring advanced third generation EDXRF technology, the Rigaku NEX LS represents the next evolution of scanning multi-element process coatings analyzers for web or coil applications. To deliver superior analytical performance and reliability, the EDXRF measuring head assembly was derived from the established Rigaku NEX Series high-resolution benchtop instrumentation. With this proven technology, the Rigaku NEX LS delivers rapid, non-destructive, multi-element analyses — for coat weight, coating thickness and/or composition — for elements from aluminum (Al) through uranium (U). The measuring head is mounted on a rigid beam and is equipped with a linear traversing mechanism positioned over a roller so that the head-to-surface distance is constant. Common applications include silicone release coaters, converters, denesting Si for vacuum-formed plastics, RoHS compliance, conversion coatings, metalized plastic, top coatings on metal coil and fire retardants on fabric.
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Product
Shielded and Unshielded Cable
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Teledyne Marine Cable Solutions
Shielding Types• Braided I Served I Spiral• Foil & Hybrid• Vapor Barriers• Copper & Alloys• Conductive & Static Dissipative Tapes• Conductive Fabrics• Tensile Members• RFI & EMI Tapes & Braids (Serveor Interwoven)• Utilizing Flat & Round Copper• Stainless Steel• Bronze• Aramid Fibers & Textile, amongothersConstruction• Multi-conductor, shielded pairs, pairs with steel tubed fiber or copper conductors with fiber optics, coaxial conductors & aramid strength fibers
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Product
Systems Integration for Circuit Card Assembly
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Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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Product
AATCC Wrinkle Recovery Tester
M272
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To determine a fabric's ability to recover after wrinkling under a predetermined load for a set period of time. Set of 3-D plastic replicas are available to grade fabrics.
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Product
Fixed Attenuator Pads
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SemiGen RF/microwave fixed attenuator pads feature precise resistor films and superior metalization resulting in superior performance and consistency. Our advanced thin-film technology allows our parts to have full side wraps for SMT installation and a complete grounding backside for ease in attachment, as no ground bonding is requried. Top side contacts for the input and output make these ideal for standard RF/microwave assembly techniques. They are available as MIL PRF 38534 “H” & “K” space screened units. Custom values are easy to fabricate and design allowing users to design in a specific value of choice.
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Product
Hot Embossing Systems
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EV Group’s series of high-precision hot embossing systems are based on the company’s market-leading wafer bonding technology. Excellent pressure and temperature control as well as uniformity over large areas allow for high accuracy imprints. Hot embossing is a cost-effective and flexible fabrication technology with very high replication accuracy for feature sizes down to 50 nm. The systems are well suited for embossing complex micro- and nanostructures and high-aspect ratio features into a wide range of polymer substrates or spin-on-polymers. The combination with stamp-to-substrate alignment allows alignment of hot embossing to pre-processed substrate structures.
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Product
72-lane, 36-port, PCI Express
PEX89072
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The new PCIe Gen 5.0 (32 GT/s) PEX89000 series builds on the longevity of the Broadcom series of switches, now spanning 13 families. The PEX89000 family allows customers to build systems from simple PCIe connectivity inside the box to high-performance, low-latency, scalable, cost-effective PCIe fabrics for composable hyper-scale compute systems supporting ML/AI and Server/Storage applications.
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Product
Substrate Manufacturing
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KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Product
10 Gigabit Ethernet AdvancedTCA® Fabric Interface Switch Blade
aTCA-3430
Switch Blade
The aTCA-3430 is a high performance 10G Fabric switch blade for AdvancedTCAR platforms. This product is ideal for bandwidth intensive telecom applications such as wireless access controllers, DPI/security network, IPTV, IP multimedia subsystems, RNC/BSC, broadband access/bearer networks, data centers, and LTE/4G network applications. The aTCA-3430 provides 10GbE hub-to-node connectivity and integrated switch silicon that supports load balancing, priority queues, packet classification, and flow control to enable strict bandwidth management for implemented applications.
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Product
Ceramic Process Carrier Pallets
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Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, semiconductive ceramic designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.
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Product
VPX / OpenVPX Chassis
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VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments.
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Product
PXIe Chassis: 10-slot, 3U, 24 GB/s, Gen 3
M9010A
Chassis
The M9010A PXIe 10-slot Gen 3 chassis delivers flexibility, compatibility, and performance in a smaller form-factor ideal for bench-top applications. With 8 PXIe hybrid slots, it gives the system designer flexibility to mix and match the number and location of PXIe and hybrid-compatible modules. The maximum performance, PCIe switch fabric can operate up to Gen 3 providing up to 24 GB/s of system data bandwidth. The new cooling design provides exceptional per-slot cooling while at the same time producing much less fan noise than the typical PXI chassis. It is also designed for easy maintenance and has features for combining multiple chassis together or integrating with other non-PXI instrumentation.
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Product
Development Kit
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The VP430 is 3U VPX RF processing system featuring the transformational Xilinx® Zynq® Ultrascale+™ RF system-on-chip technology (RFSoC). The ZU27DR device used on the VP430 includes eight integrated analog-to-digital converters at 4GSPS, eight digital-to-analog converters at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM® processing subsystem.
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Product
Coefficient of Friction Tester
COF-01
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Jinan Leading Instruments Co., Ltd.
COF-01 Coefficient of Friction Tester is applicable in static and kinetic coefficient of friction tests of plastic films, sheets, rubber, paper, PP woven bags, fabric style, metal-plastic composite strips/belts for communication cable, conveyor belts, wood, coatings, brake pads, windshield wipers, shoe materials and tyres, etc. With the material smoothness testing, users can control and adjust material quality technical indexes to meet application demands. Besides, this tester is applicable for the smoothness measurement of cosmetics, eye drop and other daily chemistry.
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Product
Bulk Acoustic Wave Technology
BAW
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Macom Technology Solutions Holdings Inc.
MACOM’s BAW product portfolio is ideal for high performance Industrial, Aerospace, Defense, and Communications applications that require critical frequency filtering. Our high-performance RF filters enable our customers manage signal integrity in the 1 to 6 GHz frequency range. Bulk Acoustic Wave Resonators consist of two metal electrodes above and below a layer of a piezoelectric material. The piezoelectric material converts an electrical signal to a mechanical signal and vice versa. The metal electrodes provide the connections to/from the piezo material. The frequency at which resonance occurs depends on the thickness of the combined metal-piezo-metal stack. Advances in thin-film piezoelectric fabrication have enabled BAW resonators to meet RF filtering challenges up to 6000 MHz using standard MEMS fabrication process. High-performance BAW resonators-based RF filters are made of piezoelectric material having high Q-factor (>3000) and high coupling coefficient. Currently, no competitive technology provides the same high performance for RF filter applications when compared to BAW resonator-based RF filter up to 6000 MHz for the same size and cost.
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Product
TPS-Effusivity Meter
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Thermal Effusivity (W√s/m2K) is described as a materials ability to exchange heat with its surroundings. Surface haptics is a branch of psychology, describing the sense of touch, localized to the skin surface. The feeling of warmth and coolness (thermal effusivity) makes up the feeling of comfort, or the desired effect, which goes into the touched material surface. This is an important field of measurement for textiles, fabrics and solids.
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Product
CXAR Custom Chassis
Chassis
Cytec has a complete metal fabrication shop and a laser etching machine so we can build custom systems with very low NRE. Module arrangement, custom labeling, custom configurations are done fairly easily and nearly 50% of the systems we build are not shown in our standard product line. Don't see what you need? Just ask!
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Product
Electronic Moisture Analyzer
MOC-120H
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The moisture content of a variety of samples can be measured using an array of drying modes. The drying status can be seen at-a-glance with the fluctuation range display. Active in a variety of fields (cereals, starch, flour, noodles, brewed products, sea foods and marine products, meat products, spices, sweets, dairy products, dried foods, vegetable oils and other food articles; pharmaceuticals; ores; cokes; glass materials; cement; chemical fertilizers; pulp and paper; cotton; various fabrics and other industrial goods); enabling measurement of samples (cereals, foods, and chemical products) under various conditions (powder, particles, paste, and liquid).
