3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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Product
DIgital 3D Image Correlation System
Q-400
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The Digital 3D Image Correlation System Q-400 is an optical measuring device for true full-field, non-contact, three-dimensional measurement of shape, displacements and strains on components and structures made from almost any material.The Q-400 system is used for determination of three-dimensional material properties in tensile, torsion, bending or combined tests. In addition, deformation and strain analysis can be applied to fatigue tests, fracture mechanics, FEA validation, and much more.
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Product
Solid Optical 3D Measurement Instrument
IF-SensorR25
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The IF-Sensor25 is a solid optical 3D measurement instrument for automated form and roughness measurement in production. The sensor is integrated into a production line and delivers you high resolution, repeatable and traceable results when measuring surface characteristics in the m or sub-m range. This resolution can hardly be achieved by conventional 2D solutions or tactile techniques.
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Product
Direct 3D RightMark
D3D RM
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D3DRightMark is an independent non-commercial open-source graphics card benchmarking project developed by iXBT.com. It's called to help users estimate graphics cards performance and quality in synthetic tests and real apps, e.g. games. Synthetic tests allow estimating performance and capabilities of separate graphics cards subsystems in order to forecast their behavior in either applications, both existing (that is overall estimation of suitability and prospects for an entire application range) and developing, provided that a given accelerator demonstrates peculiar behavior under such applications.
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Product
SPI | AOI | AXI
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Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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Product
3D Scanning Services
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The 3D scanning services provided by our 3D scanning facilities can capture 3D measurements from objects as small as a pin head or as large as a nuclear power generation facility. When we remove the constraints imposed by conventional measurement technologies, the scope of applications becomes virtually limitless with 3D digital data in hand.
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Product
USB-8451, 250 kHz I2C, 12 MHz SPI I2C/SPI Interface Device
779553-01
Interface Module
The NI USB‑8451 is a master interface for connecting to and communicating with inter-integrated circuit (I2C), System Management Bus (SMBus), and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8451 is a portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices or toggling LEDs. The USB‑8451 can be physically located more closely to I2C/SPI devices than PCI interfaces, reducing I2C bus length and minimizing noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
Clarity 3D Solver
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The Cadence Clarity 3D Solver is a 3D electromagnetic (EM) simulation software tool for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs. The Clarity 3D Solver helps designers tackle the most complex electromagnetic (EM) challenges when designing systems for 5G, automotive, high-performance computing (HPC), and machine learning applications with gold-standard accuracy.
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Product
Economy 3D Scanners
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Cost-effective 3D scanners with high-end technology, provide you with 3D scanning capabilities to fit within your budge
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Product
3D Design
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Rapid Design Exploration. Created for design engineering workflows, our intuitive product design software generates a fast user experience. Rapid design exploration includes detailed insight into real-world product performance. Live physics and accurate high-fidelity simulation combine into an easy-to-use interface that supports faster-time-to-market.
