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Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Metal Foil Low Resistance Chip Resistor
MFF
*Low Resistance / TCR / EMF / Inductance*Excellent long term stabilityRoHS compliant and halogen free.*Lead free.*High precision current sensing and voltage division.
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RTOS
LynxOS
The embedded market is exploding with the dawn of the “Internet of Things”. The basic idea being that almost everything will ultimately be connected to the internet and these embedded devices are becoming more complex. This means they need to run more full functioned operating systems, with connectivity and popular human interfaces, require more processing power, including multi-core chips, and are likely to be exposed to the same types of cyber attacks that we are facing in our corporate and personal computers.Lynx Software Technologies addresses these needs with our high performance LynxOS operating systems and tools based on open standards. Our new powerful RTOS security features allow embedded developers to design their systems to be more secure before they are connected to the internet.
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VS Tool Suite for Virtual Scan Synthesis and ATPG
VirtualScan
VirtualScan is SynTest's solution to combat increase in test data volume and test cycle volume. With VirtualScan (VS) an extremely large number of short scan chains within the SOC can be virtually accessed from outside the chip with a limited number of pins assigned as scan pins.
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Radio Module (2x2)
SX-PCEAC2
The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
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PCI Evaluation Board
BCM91250E
The BCM91250E is a full-length PCI evaluation board with the SiByte® BCM1250 dual-processor System on a Chip. The board is designed for software development and for developing PCI applications that require high-performance processors.
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ARINC 429 Bus Interfaces
AIM’s > ARINC 429 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O.
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IR Sensor
The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.
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Services
For over three decades, Teledyne Microwave Solutions has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, TMS offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. TMS offers a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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Step Recovery Diodes
SemiGen’s SSR series of Step Recovery Diodes are epitaxial silicon varactors which provide high output power and efficiencies in harmonic generator applications. Using custom epitaxial wafers, our process ensures high reproducibility. The silicon dioxide passivation process assures greater stability and low leakage currents over temperature. Uniform capacitance ensures repeatability from device to device. These diodes are available in chip or packaged form.
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Hot Electron Bolometer (HEB) Mixers/ Receivers In Terahertz Range
Insight Product Company offers Hot Electron Bolometer (HEB) mixers, receivers, and chips made from NbN or NbTiN thin film. The HEB mixers can operate at frequencies of up to several terahertz.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Cut Susceptibility Tester
King Design Industrial Co., Ltd.
*Equipment conforms to IEC61730 MST12 specification.*Pre- or post-round can be selected for control wiring connection.*With weights block’s positioning pin is removed before test; and is inserted in the rear positioning hole for the remaining time.*Equipped with rings at both front and rear end; used to connect a rope and control the driving direction.*Use replaceable special cutting chip.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Specific Gravity Tester
LD-LSGT-A10
Specific Gravity Tester LD-LSGT-A10 determines the theoretical maximum specific gravity of bituminous mixtures in accordance to ASTM D2041 Standard Test Method for Theoretical Maximum Specific Gravity of Bituminous Mixtures (Vacuum process). Adopted with single chip machine technology to shake a loose asphalt mixture sample submerged in water. Vacuum is applied into the sample, to extract out the air bubble.
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Mezzanine System
5158
The 5158 Electrical Conversion Module (ECM) provides eight (8) RS-232 outputs and eight (8) RS-232 inputs. Built around Maxim 1488 & 1489 chips for true RS232 levels and voltage tolerance, all outputs come up in the 1, mark or idle state. Electrically this is a negative output voltage, the start bit is always a 0 or a positive voltage level.
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UV Sensors
With analog (4-20mA, 0-5V, 0-10V) or digital (USB, Modbus) output, also available with Android device (incl. app). SiC photodiode chip based Broadband UV sensitivity or filtered for UVA, UVB, UVC or UV-Index spectral sensitivity. Our sensors are also available with logarithmic signal transduction, linearity from 0 … 1500 mV. Calibration services available at our Berlin facility prior to delivery and after use
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Breakout - General Purpose USB to GPIO+SPI+I2C
FT232H
This chip from FTDI is similar to their USB to serial converter chips but adds a ''multi-protocol synchronous serial engine'' which allows it to speak many common protocols like SPI, I2C, serial UART, JTAG, and more! There''s even a handful of digital GPIO pins that you can read and write to do things like flash LEDs, read switches or buttons, and more. The FT232H breakout is like adding a little swiss army knife for serial protocols to your computer!
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Reliability Testing
ELES Semiconductor Equipment SpA
ELES designs and manufacturers reliability test solutions to verify the performance of integrated circuits from concept validation to high volume production during all the test phases. No other company can provide universal equipment for all the reliability tests, or can guarantee a seamless data flow between phases or can apply on chip embedded reliability engineering for data tracking and failure investigation. Clients use our functional test data to proactively analyse variations between lots, between temperature extremes and during lifetime (often these defects escape ATE). The improvements to products and processes needed to arrive at zero defects cannot be driven by the quantity of Big Data alone, the quality of reliability data is a strategic advantage that only ELES can provide.
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Infiniium Oscilloscopes
Z‑Series
The Infiniium Z-Series delivers this and more with its RealEdge technology enabling 63 GHz of oscilloscope bandwidth and superior signal integrity. The Z-Series takes advantage of indium phosphide chip technology and custom thin film packaging to give you extremely low noise, low jitter, and high effective number of bits. These technologies allow you to see the true representation of your signal.
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Data Loggers
Premier Electrosystems has a wide range of data loggers to suit your needs. All our data loggers can be customized as per requirement. Data loggers are electronic devices which automatically monitor and record environmental parameters over time, allowing conditions to be measured, documented, analysed and validated. The data logger contains a sensor to receive the information and a computer chip to store it. Then the information stored in the data logger is transferred to a computer for analysis.
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IC Test Clips
Low-profile fine-pitch chips, desnely populated boards, or vertical boards, Pomona test clips connect you with confidence.
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PCIe Interface Accelerator Adapter
PCIe-ACC100
ADLINK’s PCIe-ACC100 is a PCIe interface accelerator adapter developed based on Intel's vRAN Dedicated Accelerator ACC100 eASIC chip. It supports 4G and 5G codec acceleration, checksum rate matching, onboard 4G ECC memory, and hybrid automatic repeat request technology (HARQ). The PCIe form factor HHHL (half-height, half-length) can meet the needs of most application scenarios.
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Single Channel Detectors
Infrared detectors for gas analysis, flame detection and radiometry in TO18 or TO39 packages.Housing types TO18 and TO39Voltage or current modeSignal processing with JFET or operational amplifierThermally compensated (optional)With special chip holder for reducing the microphonic sensitivity (optional)
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Thin Film Chip Resistors, High Stability and Reliability Type
ERA-XV/ERA-XK Series
Panasonic Industrial Devices Sales Company of America
Anti-Sulfurated Thin Film Chip Resistors From Panasonic For Dependable, Accurate And Reliable Performance In Extremely Hazardous EnvironmentsPanasonic's ERA-xV and ERA-xK Series Thin Film Chip Resistors feature a soft terminal and passivated layer. With a total of 2,889 part number variants, Panasonic ERA-xV and ERA-xK Series Resistors provide design engineers with a wide array of Resistors to choose from specifically developed to handle extremely hazardous and challenging application environments.
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BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Isolation Amplifiers
Isolation Amplifiers provide power supply designers with a higher performing, single chip alternative to isolation techniques based on optocouplers and shunt regulators. Analog Devices ADuM3190 and ADuM4190 isolated error amplifiers have a 400 kHz bandwidth, with 0.5% typical initial accuracy at 25°C and 1% total accuracy over the extended temperature range of –40˚C to +125˚C. This provides manufacturers of ac-to-dc and dc-to-dc power supplies with a significant upgrade in speed and operating temperature range, as well as a 5× improvement in transient response.
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Data Loggers
Data loggers are electronic devices which automatically monitor and record environmental parameters over time, allowing conditions to be measured, documented, analysed and validated. The data logger contains a sensor to receive the information and a computer chip to store it.
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FEC Accelerator Based On Intel® VRAN Dedicated Accelerator ACC100
PCIe-ACC100
ADLINK’s PCIe-ACC100 is a PCIe interface accelerator adapter developed based on Intel's vRAN Dedicated Accelerator ACC100 eASIC chip. It supports 4G and 5G codec acceleration, checksum rate matching, onboard 4G ECC memory, and hybrid automatic repeat request technology (HARQ). The PCIe form factor HHHL (half-height, half-length) can meet the needs of most application scenarios.
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Automated Optical Inspection
AOI
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
