Industry Pack Carrier
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Slave Dual Industry Pack Carrier
CPCI-SIP-3
The new CPCI-SIP-3Module provides a 3U high performance flexible I/Oscheme, that supports industry standard IndustryPacks. Choose from over a 100 different IndustryPacks from Alphi Tech and others. For applicationrequiring low cost, high density I/O or unique combinations, the CPCISIP-3 is the perfectsolution.
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CPCI Dual Industry Pack Carrier
CPCI-6713-2 IP
The board consists of private SDRAM and Flash memory attached to the 300 MHz, TMS320C6713B floating point DSP. An FPGA provides the timing and control. Peripherals include a serial port and connectors for IP mezzanine boards. Flash memory is available for downloading programs into a nonvolatile memory. A PCIbus connector provides the interface to the host computer.
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Dual DSP Module Quad Industry Pack Carrier
CPCI-DUALIPC-6U
The CPCI-2IPC-6U module provides a high performance flexible I/O scheme, that supports industry standard Industry PacksÔ. For application requiring high performance, high density I/O or unique combinations, the CPCI-2IPC-6U is theperfect solution.
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Industry Pack Carriers and Digital I/O
CPCI-4SIP-6U
The CPCI-4SIP-6U module provides a high performance flexible I/O scheme, that supports industry standard Industry PacksÔ. For application requiring low cost, high density I/O or unique combinations, the CPCI-4SIP-6U is the perfect solution. There are four (4) Industry Pack sites providing up to 200 I/O pins accessible from either the front panel or the rear back plane.
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Industry Pack Carriers and Digital I/O
CPCI-4pack-6U
The CPCI-4pack-6U module provides a high performance flexible I/O scheme, that supports industry standard Industry PacksÔ. For application requiring low cost, high density I/O or unique combinations, the CPCI-4pack-6U is the perfect solution. The Local DSP can be used to simply move data to and from the CPCI bus or provide pre processing functions such as local PID controls, FFT’s, digital filtering, etc. Custom application software can be downloaded to the DSPvia the CPCI bus or the local serial port.
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Intelligent CPCI Quad Industry Pack Carrier
CPCI-6713-4 IP
The board consists of private SDRAM and Flash memory attached to the 300 MHz TMS320C6713B DSP. An FPGA provides the timing and control. Peripherals include a serial port and connectors for IP mezzanine boards. Flash memory is availablefor downloading programs into a non-volatile memory. A PCIbus connector provides the interface to the host computer. A serial port is available for debugging.
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Industry Pack Carriers and Digital I/O
CPCI-2IPC-6U
The CPCI-2IPC-6U module provides a high performanceflexible I/O scheme, that supports industry standard IndustryPacksÔ. For application requiring high performance, highdensity I/O or unique combinations, the CPCI-2IPC-6U is theperfect solution. The Local DSP’s can be used to simplymove data to and from the CPCI bus or provide localprocessing functions such as local PID controls, FFT’s, digitalfiltering, etc.
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Dual Industry Pack Carrier Module
CPCI-SIP-rp
The CPCI-SIP module provides a 3U high performance flexible I/O scheme that supports industry standard Industry PacksÔ. For application requiring low cost, high density I/O or unique combinations, the CPCI-SIP is the perfect solution.The CPCI-SIP is also available with the Industry Pack lines routed to the CompactPCI P2 connector for application that require rear panel I/O.
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PCI - Quad Industry Pack Carrier w/ DSP
PCI-4IPM
The PCI-4IPM module provides a high performance flexible I/O scheme, that supports industry standard Industry PacksÔ. For application requiring low cost, high density I/O or unique combinations, the PCI-4IPM is the perfect solution.The Local DSP can be used to simply move data to and from the CPCI bus or provide pre processing functions such as local PID controls, FFT’s, digital filtering, etc. Custom application software can be downloaded to the DSP via thePCI bus. WinNT drivers are standard.
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Quad Industry Pack Carrier
PCI-4pack
The PCI-4pack module provides a high performance flexible I/O scheme, that supports industry standard Industry PacksÔ. For application requiring low cost, high density I/O or unique combinations, the PCI-4pack is the perfect solution. The Local DSP can be used to simply move data to and from the CPCI bus or provide pre processing functions such as local PID controls, FFT’s, digital filtering, etc.Custom application software can be downloaded to the DSP via the PCI bus. Windows 95 and WinNT drivers are standard.
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Industry Pack Carriers and Digital I/O
CPCI-IPC
The CPCI-IPC module provides a 3U high performance flexible I/O scheme, that supports industry standard Industry Packs™. For application requiring low cost, high density I/O or unique combinations, the CPCI-IPC is the perfect solution. The Local DSP can be used to simply move data to and from the CPCI bus or provide pre processing functions such as local PID controls, FFT’s, digital filtering, etc. Custom application software can be downloaded to the DSP via the CompactPCI bus. A very low cost, non-intelligent version is also available, CPCI-SIP.
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3U CompactPCI Serial M.2/U.2/SATA Storage Carrier
cPCI-A3H20
- 1x NVMe M.2 and 1x NVMe U.2 drive slot- 1x optional SATA 6Gb/s M.2 drive slot shared space with NVMe U.2- Status LEDs on faceplate: drive activity, hot-swap status, user-configurable- Operating temperature: -40°C to +85°C with qualified modules- EN50155 compliant
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Intel® Atom™ Processor E3845 Fanless Expandable Embedded Computer with PCI/PCIe Slots
MXC-2300
Featuring the latest Intel® Atom™ E3845 processor, the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost-efficiency over any previous generation Atom-based system.
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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COM Express Type 6 evaluation carrier board
ATX-M-CC462-T6
The ATX-M-CC462-T6 is a fully featured COM Express Type 6 evaluation carrier board designed for use with the WINSYSTEMS Intel® Tiger Lake UP3 COM Express and other COM Express Type 6 modules.
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Computer On Module
ITX-M-CC452-T10
The ITX-M-CC452-T10 is an industrial Mini-ITX small form factor Type 10 reference carrier board designed to fully test WINSYSTEMS’ COMeT10-3900 COM Express Type 10 Mini module. The carrier board adheres to the PICMG COM Express specifications providing compatibility with other COM Express mini type 10 modules.
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COM-HPC Server Type Reference Carrier Board in Extended ATX Form Factor
COM-HPC Server Base
The COM-HPC Server Base is an extended ATX size COM-HPC Server Type reference carrier board based on PICMG COM-HPC Revision 1.0. Together with the COM-HPC Server Type module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Ultra HD Surgical Monitor Series
ASM27UHB
The ASM27UHB Series of medically certified UHD surgical monitors features clear image and accurate color reproduction to fully support medical personnel. As a result of its hygienic surface design that eliminates exposed screw heads and air vents, the ASM Series can be easily and quickly cleaned using all common disinfectants and cleaning agents. This ensures a high level of hygiene in pathogen-sensitive environments such as the OR. The ASM Series’ hygienic design also can speed up turnaround time and operating theater preparation.
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High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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PXI FPGA Module
FIO168
Using OpenATE USB/PXI FPGA Carrier, you can develop your design to define custom I/O and control Hardware without prior knowledge PCI I/O and USB interface.
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6U CompactPCI Dual 64-bit PMC Slots Carrier Board
cPCI-8602
- Supports two single-size 32,64-bit/33,66 MHz PMC sites in 4HP width- PICMG® 2.0 32,64-bit/33,66 MHz cPCI bus- PICMG® 2.1 Hot Swap Specification Compliant- 3.3V or 5V V(I/O) for cPCI bus and PMC sites- PLX® PCI-to PCI bridge PCI6154 for PCI bus- Power and HotSwap LED incidators on front panel
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Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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SMARC 2.1 Reference Carrier Board with M.2 Extension
I-Pi SMARC Plus
The I-Pi SMARC Plus is small (110mm x 110mm) SMARC reference carrier board based on SGeT SMARC (Smart Mobility ARChitecture) 2.1 hardware specification. Together with the SMARC short size module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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3U CompactPCI® Serial XMC Module Carrier Blade
cPCI-A3XMC
- 3U 4HP CPCI-S.0 peripheral- One XMC slot- Operating temperature: -40°C to 85°C with qualified components
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Ultra HD Surgical Monitor Series
ASM32UHB
The ASM32UHB Series of medically certified UHD surgical monitors features clear image and accurate color reproduction to fully support medical personnel. As a result of its hygienic surface design that eliminates exposed screw heads and air vents, the ASM Series can be easily and quickly cleaned using all common disinfectants and cleaning agents. This ensures a high level of hygiene in pathogen-sensitive environments such as the OR. The ASM Series’ hygienic design also can speed up turnaround time and operating theater preparation.
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Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
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COM-HPC Client Type Reference Carrier Board in ATX Form Factor
COM-HPC Client Base
The COM-HPC Client Base is an ATX size COM-HPC Client Type reference carrier board based on PICMG COM-HPC Revision 1.0. Together with the COM-HPC Client Type module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3002
- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXE-5500 Series
ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.
