JEDEC
semiconductor test methods and standards setting organization, Joint Electron Device Engineering Council.
See Also: UFS
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Wafer ESD Tester lineup
Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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LPDDR
A large number of LPDDR sockets have been developed to cover the wide variety of ball I/O configurations. This catalog supports the JEDEC 209 Standard configuration.
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ESD, Latch-up testing / design service
ESDdoctor
ESDdoctor consulting service can identify, diagnose, and solve any ESD/EOS problem quickly and definitively, at a surprisingly low entry cost. You can choose testing and diagnosis only, or add ESD design services to the consulting package. ESD, Latch-up testing: HBM (ANSI/ESDA and JEDEC) on packaged dies. MM (ANSI/ESDA and JEDEC) on packaged dies. Latch-up JEDEC on packaged dies TLP on packaged and bare dies.VF-TLP on bare dies.
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Flash SATA Disk /mSATA SATA 3 SLC,MLC
FSA 300 Series
*SATA III (6.0Gb/s) interface*Capacity: SLC 1 GB to 64 GB, MLC 4 GB to 128 GB*iSMART disk health monitoring*Intelligent error recovery system*Write protection security*Anti-vibration mechanical design*Excellent data transfer speed*Zero mechanical interference*JEDEC standard MO-300B dimension
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test measurement unit
ITC59100 Rg/Qg
The ITC59100 Test Measurement Unit (TMU), which plugs into the ITC59000 Test Platform, performs gate charge (Qg) measurements that conform to MIL-STD-750C, Notice 2, Method 3471 and JEDEC Standard JESD24-2. In addition the ITC59100 TMU performs an internal gate resistance (Rg) test method that conforms to JEDEC Standard JESD24-11.
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Sideband Bus Protocol Analyzer
FS2700 DDR5
The FS27xx DDR5 Sideband Bus Protocol Analyzer is the latest DDR5 tool from FuturePlus Systems. FuturePlus has taken the complexity of 8 different JEDEC specifications and ported them into this very useful tool. DDR5 Validation Engineers and system integrators will not have to comb through complex specifications defining thousands of bits and register addresses. The tool takes care of this. Please request our data sheet for more information.
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High Performance Chipscale Test Sockets
SC
Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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QFP-to-PGA JEDEC 132-Position, 0.025 [0.64] Pitch Adaptor
95-132I25
QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Semiconductor Package Wind Tunnel
WT-100
Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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Analyzer Probes
The following probes are available for the MA51x0 and MA41x0 series analyzers. These probes are designed for low-voltage and high-speed midbus probing or probing with an interposer. The following JEDEC memory standards are widely used by these probes: DDR5 (JESD79-5), DDR4 (JESD79-4), DDR3 (JESD79-3), LPDDR5 & LPDDR5X (JESD209-5), LPDDR4 & LPDDR4X (JESD209-4), and LPDDR3 (JESD209-3).
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DDR4 Parametric Test Reference Solution
Keysight's DDR4 parametric test reference solution helps verify the signal integrity of DDR4 memory designs according to JEDEC specifications.
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±6 kV ANSI/ESDA/JEDEC 2-Pin HBM Tester
HBM-S1-B
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) 2-pin tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*Optionally available upgrade for all HPPI TLP-3010C, 4010C, 8010A, and 8010C hardware systems and software (upgrade on request)*Suppression of trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT voltage and DUT current sensor for real time voltage and current monitoring*Integrated DC test DUT switchIntegrated hardware 50 Ω trigger output for high speed digital oscilloscopesIntegrated overvoltage protection of voltage sense and DC test interfaces for oscilloscope and SMU protection during high voltage HBM testing*Fast and efficient HBM measurements including transient waveform data management using the HPPI TLP software*Compact size 145 mm x 82.5 mm x 44 mm
