Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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Product
Pin-Line™ Collet Socket with Wire Wrap Pins
Series 0503
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Pin-Line Collet Sockets with Wire Wrap Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with wire wrap or solder tail pins. Consult Data Sheet No. 12013 for solder tail pins. Break feature allows strips to be cut to the number of positions desired.
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Product
Pin-Line™ Collet Socket with Solder Tail Pins
Series 0513
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Pin-Line Collet Sockets with Solder Tail Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with solder tail or wire wrap pins. Consult Data Sheet No. 12014 for wire wrap pins. Break feature allows strips to be cut to the number of positions desired.
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Product
Deci-Center™ Jumpers
SERIES 150/151
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DECI-CENTER JUMPERS. Pitch bars help maintain .100 [2.54] conductor spacing.Consult factory for jumper lengths under the specified minimum length.
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Product
Mini-Link™ Miniature Jumper
Series ML-100
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Mini-Link Miniature Jumpers. Used to jumper from row-to-row or from pin-to-pin. Their miniature size makes it possible to stack one on top of the other. A convenient test probe slot is provided as well. Mini-Links are available from the factory with or without a handle, used for ease of inserting or extracting.
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Product
Hybrid Socket
CSP/Ballnest
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Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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Product
Elevator Socket with Bifurcated Contacts
Series 8XXX
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Elevator Sockets with Bifurcated Contacts. Ideal for elevating devices (displays, switches, etc.) to desired level with .260 to 1.250 [6.60 to 31.75] height extension.
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Product
PLCC-to-DIP Adaptor
Series 352000/353000
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PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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Product
QFP-to-PGA JEDEC 132-Position, 0.025 [0.64] Pitch Adaptor
95-132I25
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QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
SOWIC-to-DIP Adaptor 14 to 28 Pins
Series 35W000
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SOWIC to DIP Adapters - 14/28Pins. A cost effective means of upgrading to SOIC without changing your PCB layout.
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Product
Pin-Line™ Vertisocket™
Series 0517
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Pin-Line Vertisockets. For mounting components, jumpers, etc., at right angle to PC board. Available 1 to 25 positions; cuttable to any number desired.
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Product
Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
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Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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Product
SOIC-to-SOWIC Adaptor
XX-666000-00
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SOIC to SOWIC Adapter. Allows the use of a narrow package IC in place of a wide one.
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Product
PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adaptor
Series 505
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PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices.
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Product
Economy Model Vertisocket™
Series 800 and 822
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Thrifty Model Vertisockets with Bifurcated Contacts. These low cost VertisocketsTM are recommended for high volume vertical display mounting applications. Very useful for connection of board-to-board jumpers and for DIP switches as well as LED devices.
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Product
Lo-PRO®file Collet Socket with Wire Wrap Pins
Series 503
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LO-PRO file Collet Sockets with Wire Wrap Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12011 for solder tail pins. Choose from several sizes and plating options.
