EV Group
EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes.
- +43 7712 5311 0
- Sales@EVGroup.com
- DI Erich Thallner Strasse 1
St.Florian am Inn, A-4782
Australia
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Product
LITHOSCALE® Maskless Exposure Lithography Systems
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Maskless exposure lithography systems represent an entirely new product platform of EVG lithography equipment.
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Product
UV-NIL / SmartNIL® Systems
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EV Group provides a complete product line for UV-based nanoimprint lithography (UV-NIL), including different single-step imprinting systems, large-area imprinters as well as step-and-repeat systems for efficient master fabrication. Besides soft UV-NIL, EVG offers its proprietary SmartNIL technology with multiple-use polymer stamp technology. The efficient and robust SmartNIL process provides high pattern fidelity, highly uniform patterned layers and minimum residual layers, combined with easy scalability in wafer size and production volume. EVG´s SmartNIL redeems the long-term promise of nanoimprinting being a high-performance, low-cost and volume-capable manufacturing technology for mass production of micro- and nanoscale structures.
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Product
Process Development Services
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EV Group’s comprehensive process knowledge is a result of our decades of experience. This knowledge creates benefits and advantages for our customers from the early stages of process development to the final goal of high-volume production where our process engineering services offer comprehensive technical support and advice to the semiconductor industry. With state-of-the-art application labs at our headquarters in Austria, along with North America and Asia, EV Group is focused on delivering superior process expertise to our growing global customer base every step of the way. We can provide support for initial development through final integration at the customer’s site. Process know-how is key to achieving the shortest time to market for your product.
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Product
Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
