ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
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ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Product
64-CH Isolated Digital I/O Modules
cPCI-7432/7433/7434
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- Two external interrupt sources for cPCI-7432/7432RP/7433- 3U Eurocard form factor, CompactPCI compliant (PICMG 2.0 R2.1)- 32-CH isolated digital inputs & 32-CH isolated digital outputs for cPCI-7432- 64-CH isolated digital inputs for cPCI-7433- 64-CH isolated digital outputs for cPCI-7434/7434P- 5000 VRMS isolation voltage
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Product
AI-Enabled Video Analytics Platform
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Railway efficiency is not bounded by gauge or speed. Rather, AI deployed on railway computing infrastructure, especially at the network edge, has tremendous potential to improve operations and bottom lines. ADLINK's line of EN 50155 compliant AI-enabled platforms offer rail solution providers a high level of flexibility to select the configuration best suited to their use cases, and help them accelerate their railway digital transformation with edge AI.
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Product
Motion Control Terminal Board for Panasonic MINAS A4 Servo Amplifiers
DIN-814P-A40
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This well-designed motion control terminal board is for the users who use Panasonic MINAS A4 super servo. With this terminal board, users can ealisy complete wiring with PCI-8174, PCI-8164, PCI-8154, PCI-8158 and PCI-8134.
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Product
6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
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- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
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Product
Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3000
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- Medical grade computer compliant with IEC 60601-1:2005 + A1:2012 + A2:2020 (3.2 edition) / IEC 60601-1-2:2014 + A1:2020 (4.1 edition)- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Product
OSM Size-L Module With NXP® I.MX8M Plus Series
OSM-IMX8MP
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The OSM-IMX8MP is an OSM R1.1 Size-L module featuring NXP® i.MX 8M Pluss series processor with 4-core Arm Cortex-A53 and M7, up to 8GB LPDDR4L memory and up to 128GB eMMC storage. With its in-SoC 2.3 TOPS NPU and Vivante GC7000UL graphics, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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Product
2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7211
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The MECS-7211 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. The MECS-7211 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 450mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7211 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Product
SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC
LEC-RB5
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The ADLINK LEC-RB5 is a SMARC module powered by the Qualcomm® QRB5165 SoC with 8 Arm Cortex-A77 cores and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.
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Product
Frame Grabber/ Video Capture Cards
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- Full product line support, including analog, GigE Vision, IEEE 1394b, Camera Link, HDMI, and 3G-SDI- Compatible with most popular cameras and software- Carefully selected embedded components ensure long term availability- Highly integrated with ADLINK I/O cards and embedded computing platforms
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Product
MXM 3.1 Type A based on Intel® Arc™ GPU
MXM-AXe
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Integrating Intel’s latest line of powerful, discrete graphics — Intel® Arc™ — ADLINK introduces its MXM-AXe, one of the industry’s first MXM (R3.1) Type A discrete GPU modules. Packing hardware ray tracing, AI acceleration, and support for 4x 4K displays, the module enhances responsiveness, precision, and reliability for graphics-demanding, time-sensitive edge applications in commercial gaming, healthcare, media processing, and transportation. ADLINK MXM-AXe provides up to 8 hardware ray-tracing cores, 128 execution units, 4GB GDDR6, and 8x PCIe Gen4 at maximum 35W TGP and the industry’s first full AV1 hardware encoding.
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Product
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
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The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Product
3U 7th Generation Intel® Core™ i3-7100E Processor-Based PXI Express Gen3 Controller
PXIe-3937
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The ADLINK PXIe-3937 PXI Express embedded controller, based on the 7th gen Intel® Core™ i3 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
6th Generation Intel® Core™ i7/i5/i3 Fanless Computer
MVP-6010/6020 Series
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ADLINK's newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
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Product
Full HD Surgical Monitor Series
ASM27FHB
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The ASM27FHB Series of medically certified FHD surgical monitors features clear image and accurate color reproduction to fully support medical personnel. As a result of its hygienic surface design that eliminates exposed screw heads and air vents, the ASM Series can be easily and quickly cleaned using all common disinfectants and cleaning agents. This ensures a high level of hygiene in pathogen-sensitive environments such as the OR. The ASM Series’ hygienic design also can speed up turnaround time and operating theater preparation.






















