ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
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Product
USB DAQ
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ADLINK USB DAQ modules leverage the expertise of ADLINK's analog design capability, enhancing convenience of data acquisition. Simply plug the ADLINK USB DAQ into a USB port on your computer or notebook for performance equaling or even exceeding that of ADLINK PCI/PCIe DAQ cards, with no need to power down or open the chassis. As well as providing basic voltage measurement, ADLINK USB DAQ modules feature built-in signal conditioning to directly receive measurement from most commonly used sensors, with no need for extra signal processing. From basic testing to high-accuracy measurement, from portable application to industrial automation, the ADLINK USB DAQ series delivers easy, efficient, and accurate measurement every time.
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Product
Embedded MXM Modules
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ADLINK’s Embedded MXM GPU modules - based on NVIDIA's embedded GPUs - can boost the performance of a wide range of workloads, including image processing and analysis, computing acceleration, and artificial intelligence (AI). ADLINK’s Embedded MXM GPU modules offer high performance, high data bandwidth, power efficiency, and longevity support in a reduced hardware footprint, well-suited for size, weight, and power (SWaP) constrained applications. ADLINK’s Embedded MXM GPU modules can increase system responsiveness and accuracy, as well as decrease latency, and are an ideal fit for industrial automation, healthcare, transportation, aerospace and defense, gaming, and telecom applications.
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Product
NVIDIA GPU And Intel® Xeon® AI Computing Platform For Autonomous Drive Applications
AVA-3510
Electronic Control Unit
The AVA-3510 Series is powered by an Intel® Xeon® E processor coupled with workstation-grade Intel®C246 chipset to support up to 64 GB ECC DDR4 memory. The system incorporates one 2.5" SSD 256G for easy installation as optional accessories for fast read/write performance.
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Product
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
Computer on Module
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Product
COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
Computer on Module
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
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- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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Product
NVIDIA® Jetson Xavier™ SOM-Based Platform for Rapid Development of ROS and AI Applications
ROScube Pico NPN
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The ROScube Pico Series is an integrated development board powered by an NVIDIA® Jetson Xavier™ NX and Nano system-on- module (SOM) platform designed for rapid development and deployment of ROS and AI applications. The straightforward design allows users to quickly get started on development using open-source ROS libraries and packages. In addition to NVIDIA JetPack SDK, the ROScube Pico NX/Nano supports the full complement of resources provided by ADLINK’s Neuron SDK, Neuron IDE, and Neuron Library. The ROScube Pico NX/Nano is especially suited for robotic applications that demand cost-effective deployment without compromising AI computing capability.
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Product
96-CH High-Driving DIO Card
PCI-7396
Analog Input Module
The PCI-7396 is 96-bit parallel digital input/output (DIO) cards designed for industrial applications. The PCI-7396 emulates four 8255 Programmable Peripheral Interface (PPI) chips. Each PPI offers three 8-bit DIO ports which can be accessed simultaneously. The total 12/6 ports can be configured as input or output independently.
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Product
COM Express Type 7
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One of the most fundamental innovations of the COM Express Type 7 pinout is the support of up to four 10GbE interfaces, essential for the next generation of edge node appliances. Type 7 modules are headless (no graphics), which is why they are also referred to as “Server Level COM Express”.
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Product
PXI Switch - 16-CH General-Purpose SPDT Relay Module
PXI-7901
Relay
ADLINK PXI-7901 is a general-purpose (GP) switch module implementing 16-CH independent single-pole double-throw (SPDT) relays (1 Form C). PXI-7901 can connect one input to one output and be used as signal switching and routing for measurement system or ATE. Thanks to its high switching capacity, PXI-7901 can also be used to turn on or turn off devices such as motors, fans, heaters, and lights. The contact position of the relays can be changed either by direct software commands or by following the instructions previously stored in the on-board scan list. The scan list advances upon the trigger from external measurement devices, such as a DMM. The scan list could also advance when the scan-delay timer expires. In the PXI-7901, PXI trigger functions are supported and software programmable. Multiple modules can therefore be synchronized without additional field wiring.
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Product
14th Gen Intel® Core™ Ultra 7/5-Based Advanced Embedded Box PC
EMP-520 Series
Box PC
- 14th Gen. Intel® Core™ Ultra 7/5 Processors (Meteor Lake-H/U)- DDR5-5600MHz up to 96GB (48GB per DIMM)- 4x independent displays support EDID Emulation- 2x 2.5GbE, 1x COM, 6x USB ports, Type C Thunderbolt (optional)- 2 x Wi-Fi/BT/LTE antenna holes- M.2 2280 (SSD), M.2 3042 (LTE), M.2 2230 (Wi-Fi/BT)- VESA mount (optional)
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Product
1 PICMG® CPU, 1 PCI-E® x16, 3 PCI-E® x4, 7 PCI™ Slots Backplane
EBP-13E4
Backplane
- Segment: 1- Slots:1 PICMG® CPU, 1 PCI-E® x16, 3 PCI-E® x4, 7 PCI™- Support ATX power supplies- Dimension: 330 mm x 318 mm
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Product
16-CH 0-20mA Analog Input EtherCAT Module
EPS-3216
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ADLINK's EPS slave system features modular design for flexible high channel density, rugged construction, easy maintenance, and intelligent performance, compatible with 3rd party EtherCAT products. Precise time-deterministic control enables I/O synchronization for critical applications, and FPGA and ARM technology allow users to fully monitor status of EPS modules and systems, including operating temperature and usage cycle of relay switching, as well as motion control status for general purpose motor drive control. In addition, the ADLINK EtherCAT configurator enables auto-scan and configuration across EtherCAT systems. The EPS" unique structural and electronic design supports hot-swappable function, reducing repair time, and the rugged construction and operating temperature range of -20°C to 60°C allow operation in the harshest environments.
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Product
Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
Industrial Computer
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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Product
3U Enclosure with 32-bit Backplane, CompactPCI Redundant Power Supply
cPCIS-1202
Backplane
- Dual 3U CompactPCI® systems, each with five peripheral slots and one system slot- 1/1 250 W CompactPCI® Power supplies- Suitable for both rack-mount and desktop applications- Comprehensive EMC shielding- Optional rear I/O configuration (cPCI 50mm depth RTMs)






















