QES Mechatronic Sdn Bhd
Strong R&D and technology partnerships allowed us to be a global manufacturer of inspection and handling equipment.
- +603-5882 6060
- +603-5567 9078
- sales.qmc@qesnet.com
- No. 2, Jalan Jururancang U1/21
Hicom-Glenmarie Industrial Park
Shah Alam, Selangor 40150
Malaysia
Categories
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product
Automated Handling System
AHS Series
A provider of automation solutions, as well as specialized material handling equipment such as enclosed conveyor systems.
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product
Vison Inspection System
High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
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product
Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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product
Automated Optical Inspection System
AOI Series
Perform visual inspections of printed circuit boards (PCB) during manufacturing in which a camera is used to scan the board in extremely fine detail to check for any defects or failures.
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product
Optical Inspection System
OIS Products
A manual optical inspection system that is able to inspect the wire-bonded leadframe or substrate.
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product
Advanced Metrology System
AMS Series
Precision systems for accurate measurement and quality control in semiconductor manufacturing.
